Optical recording medium and its mfg. method
An optical recording medium and recording layer technology, which is applied in the manufacture of optical record carriers, optical record carriers, and record carrier materials, etc., can solve the problems of corrosion, high price, and no disclosure of technical ideas.
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Embodiment 1
[0261] A polycarbonate substrate with a thickness of 0.6 mm is formed by injection molding. The polycarbonate substrate is provided with a guide groove with a groove width of 0.25 μm, a groove depth of 27 nm, and a period of 4.26 μm of the swing groove. The substrate is sputtered on the substrate. A first protective layer, a recording layer, a second protective layer, a third protective layer, and an Ag reflective layer with a purity of 99.99% by weight were sequentially laminated.
[0262] The first protective layer and the second protective layer use ZnS·SiO 2 (80 / 20 mol%), the film thickness of the first protective layer was set to 80 nm, and the film thickness of the second protective layer was set to 14 nm.
[0263] The recording layer uses Ga 3 Ge 3 Mn 4 Sb 70 Te 20 , The film thickness is set to 16nm.
[0264] The third protective layer uses a Si film with a thickness of 4 nm. The electronegativity of Si is 1.8, and a material smaller than the electronegativity of Ag of 1.9...
Embodiment 2-13
[0277] A polycarbonate substrate with a thickness of 0.6 mm is formed by injection molding. The polycarbonate substrate is provided with a guide groove with a groove width of 0.25 μm, a groove depth of 27 nm, and a period of 4.26 μm of the swing groove. The substrate is sputtered on the substrate. A first protective layer, a recording layer, a second protective layer, a third protective layer, and an Ag reflective layer with a purity of 99.99% by weight were sequentially laminated.
[0278] The first protective layer and the second protective layer use ZnS·SiO 2 (80 / 20 mol%), Ga is used for the recording layer 3 Ge 3 Mn 4 Sb 70 Te 20 , The third protective layer uses the materials shown in Table 3-1 below. The film thickness and manufacturing conditions of each layer at this time are described in Table 3-1.
[0279] Next, an ultraviolet curable resin with a room temperature viscosity of 120 cps was coated on the Ag reflective layer by spin coating, and then cured. The glass transi...
Embodiment 14~18
[0304] Examples 14-18, Comparative Examples 8-10
[0305] A polycarbonate substrate with a thickness of 0.6 mm is formed by injection molding. The polycarbonate substrate is provided with a guide groove with a groove width of 0.25 μm and a groove depth of 27 nm. The sputtering method is sequentially laminated on the substrate to form the first protection Layer, recording layer, second protective layer, third protective layer, and Ag reflective layer with a purity of 99.99% by weight.
[0306] The first protective layer and the second protective layer use ZnS·SiO 2 (80 / 20 mol%), the thickness of the first protective layer was 80 nm, and the thickness of the second protective layer was 14 nm.
[0307] Recording layer uses Ge 2.0 Ag 0.5 In 5.0 Sb 68.5 Te 24.0 , The film thickness is set to 16nm.
[0308] The third protective layer used SiC as a target, and used the mixed gas shown in Table 4 below, and sputtered at a pressure of 0.5 Pa and a power of 1 kW to form a film with a thic...
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