Method of cutting workpiece of film filter

Abstract

The method includes two implementing modes. In the first mode, before cutting the work piece, the transition layer connects the assistant substrate to the glass substrate. In the second mode, an other work piece comprises one glass substrate with the thickness being thicker than the final expected thickness. Then, the unwanted part of the glass substrate is removed. The method of the two implementing modes increases the effective thickness of the work piece so as to reduce residual stress of the film filter plate finished product. Moreover, the risk of the film stack peeled off from the glass substrate is reduced when the work piece is cut.

Description

【Technical field】 [0001] The invention relates to a cutting method of a film filter workpiece, in particular to a cutting method of a dense wavelength division multiplexing (Dense Wavelength Division Multiplexing, DWDM) thin film filter workpiece. 【Background technique】 [0002] Optics and semiconductor technology have a great impact on social development, especially in the fields of electronic information and optical communication, and thin film technology is one of the application branches. These films can be single or multilayer coatings on substrates, or stand alone. [0003] Peak insertion loss is an important parameter for evaluating thin film filters. At present, a variety of precise control technologies have been developed, making it possible to deposit multi-layer thin films on the substrate, so that dense wavelength division multiplexing thin-film filters can meet the needs of increasing the number of cavities and reducing the channel spacing. These techniques in...

AI Technical Summary

Problems solved by technology

[0006] The above-mentioned existing method is suitable for ordinary thin-film filters with fewer film layers. However, the number of film layers of DWDM thin-film filters may exceed 150 layers. When the blade 301 of the cutting device 300 cuts the workpiece, the film stack will be caused The additional pressure inside increases the internal stress of the film layer. The pressure caused by the blade 301 will superimpose with the residual stress of the film stack, thereby increasing the peak insertion loss of the finished product and even distorting its spectrum. Moreover, the pressure may be reduced during cutting. destroy the stack

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