Semiconductor module and method for mfg. semiconductor module

Abstract

Production of a semiconductor module (31) comprises: (a) applying a structured connecting layer (11) on a supporting substrate; (b) applying active switching units (12) and / or passive switching units (13) with contact surfaces (12', 13') pointing to a transfer substrate on the structured connecting layer; (c) connecting the switching units with each other using a filler (14) between the units; (d) removing the transfer substrate; and (e) applying electrical connecting units (16) to selectively contact the contact surfaces of the switching units. An Independent claim is also included for a semiconductor module produced by the above process.

Description

technical field

[0001] The invention relates to a semiconductor module and a method for manufacturing the semiconductor module. Background technique

[0002] Semiconductor modules such as those used in computer systems or memory devices of computer systems generally constitute a module form. A conventional memory module must have two main sets of components. One is active or passive circuit components, and the other is a printed circuit board. The printed circuit board serves as a carrier for circuit components, provides connection elements such as conductive tracks, and makes connections to the outside.

[0003] Active circuit devices, such as memory chips, are individual packaged chips. The following functions are implemented in this package: connection between the contacts of the chip to form a type of rewiring (lead frame, interposer). This may be done through a bonding process or through small solder beads, the internal connection elements. This rewiring serves as ...

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