Glass substrate and glass cutting method

Abstract

A glass substrate excellent in strength properties and a glass cutting method are provided. When a glass substrate having predetermined size is to be formed by cutting a glass plate, any crack or chip is not generated on a cut face. Therefore, a pulverized powder is prevented from being generated from this portion. A glass substrate is obtained by cutting at least with laser light radiation so that a surface roughness of cut side faces and of the glass substrate are 50 nm or less and a depth of laser marks and on the cut side faces are 0.06 mm or more.

Description

[0001] Cross References to Related Applications [0002] This application is based on Japanese Priority Document JP2002-215760 filed with Japan Patent Office on July 24, 2002, which is incorporated herein by reference in its entirety. technical field [0003] The present invention relates to a glass substrate formed by cutting glass with laser irradiation and forced cooling, and to a glass cutting method. Background technique [0004] For a glass cutting method of vertically and horizontally cutting a glass plate to produce a glass substrate having a predetermined width and length, a mechanical cutting method as described in Japanese Patent Laid-Open Publication No. 11-71124, or a laser cutting method using laser rays is generally used. [0005] In the case of cutting methods with a mechanical process, the glass is cut by pressing the blade against the glass to create an intermediate crack, ie a crack that propagates perpendicularly to the glass surface. In this cutting met...

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Problems solved by technology

[0009] However, if a cutting method with only ordinary laser rays is used on the cut side of the glass substrate 1 formed by irradiating laser light, such as Figure 8 As shown in the illustrated schematic cross-sectional structure, micro cracks and broken glass are disadvantageously generated in the laser mark 2 appearing from the laser irradiation side

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