Thermal interface material
A technology of thermal interface materials and heat conductors, applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems of thermal interface material performance degradation, increase the thermal conductivity of composite materials, and small thermal conductivity, and achieve high thermal conductivity. Excellent thermal conductivity and small particle diameter
Inactive Publication Date: 2004-08-04
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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Problems solved by technology
A common defect of this type of material is that the thermal conductivity of the entire material is small, with a typical value of 1W / mK, which is increasingly unable to meet the needs of the heat dissipation effect of the increase in the degree of semiconductor integration, and the content of thermally conductive particles in the polymer carrier is increased. Making the particles contact each other as much as possible can increase the thermal conductivity of the entire composite material. For example, some special thermal interface materials can reach 4-8W / mK. However, when the content of thermally conductive particles in the polymer carrier increases to a certain extent, it will Make the polymer lose its original performance, such as the oil will become hard, so the wetting effect will become worse, and the rubber will also become harder and lose its proper flexibility, which will greatly reduce the performance of the thermal interface material
In addition, the size of the thermally conductive particles is larger, which affects the reduction of the thickness of the thermal interface material
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[0009] The carbon nanospheres selected in the present invention are polyhedral carbon clusters composed of multi-layer graphite in a sphere-in-sphere form, which can be hollow carbon nanospheres or filled metal carbon spheres. The shape can be spherical, ellipsoidal or capsule structure, the diameter of the carbon nanosphere is 5-50 nanometers, and the average diameter is 30 nanometers.
[0010] The thermal interface material provided by the present invention distributes carbon nanospheres in the polymer matrix. The process of distributing the carbon nanospheres in the polymer can first liquefy the polymer, and then directly add a certain amount of carbon nanospheres for uniform mixing, and then The polymer is cured and molded to form a thin thermal interface material. After the polymer is cured, the carbon nanosphere particles can be stabilized therein.
[0011] The weight ratio of carbon nanospheres in the thermal interface material of this embodiment is 60%, the average di...
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Abstract
A thermal interface material used between heat source and radiator is based on the heat conductivity of carbon nanoballs is composed of basic polymer body and carbon nano balls dispersed in said basic polymer body. Its advantage is high thermal conductivity.
Description
【Technical field】 [0001] The invention relates to a thermal interface material, especially a thermal interface material containing carbon nanospheres. 【Background technique】 [0002] In recent years, with the rapid development of the integration process of semiconductor devices, the degree of integration of semiconductor devices has become higher and higher. However, the volume of devices has become smaller and smaller, and the requirements for heat dissipation have become higher and higher, so heat dissipation has become a very important task. The important issue is that in order to meet these needs, various heat dissipation methods are widely used, such as using fans for heat dissipation, water-cooled auxiliary heat dissipation, and heat pipe heat dissipation, etc., and achieve certain heat dissipation effects. However, due to the unevenness of the contact surface between the heat sink and the semiconductor integrated device, there is no ideal contact interface, and genera...
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IPC IPC(8): C08K9/00C09K5/14
Inventor 陈杰良吕昌岳
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD