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Hydrogenation of methane diphenylamine homolog and epoxy resin cured therefrom

A methylene bridged and resin technology, applied in the field of methylene bridged polyamine and its preparation, can solve the problems of long reaction time, unsuitable raw material for hydrogenated methylene diphenylamine, low yield and the like, and achieves The effect of excellent thermal performance

Active Publication Date: 2004-08-11
EVONIK OPERATIONS GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This pretreatment overcomes the disadvantages of low yield (52.4%) and long reaction time associated with nickel and cobalt
While ruthenium catalysts can generally be used for the hydrogenation of pure methylene dianiline without pretreatment, they are not suitable for the hydrogenation of methylene dianiline starting materials containing impurities such as isomers

Method used

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  • Hydrogenation of methane diphenylamine homolog and epoxy resin cured therefrom
  • Hydrogenation of methane diphenylamine homolog and epoxy resin cured therefrom
  • Hydrogenation of methane diphenylamine homolog and epoxy resin cured therefrom

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0063] A series of epoxy curing agents are prepared from heavy MPCA raw materials by blending various raw materials. These samples were then compared with MPCA epoxy curing agent, where MPCA is based on US5,280,091.

[0064] Sample 1 was prepared by hydrogenating MDA-50, then removing the 2-ring component, leaving the heavy MPCA as the bottom fraction.

[0065] Sample 2 was prepared by hydrogenating a 1:1 mixture of MDA-85 (15% oligomer) and MDA-50, and then removing the 2-membered ring component, leaving the heavy MPCA as the bottom fraction.

[0066] Sample 3 was prepared from a 1:1 mixture of MDA-85 and MDA-50. After the hydrogenation (going deeper to obtain higher secondary amine components), the 2-membered ring component is removed, and the heavy MPCA remains as the bottom fraction.

[0067] Sample 4 is similar to sample 3, except that there is a higher level of partially hydrogenated methylene diphenylamine (ABCHA) but a lower content of secondary amines.

[0068] Control sa...

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Abstract

This invention relates to improved polyepoxide resins cured with a mixture of methylene bridged poly(cycloaliphatic-aromatic)amines and a process for preparing such polyepoxide resins as well as to the methylene bridged poly(cycloaliphatic-aromatic)amine compositions and a method of making them. The improvement resides in using a curative (herein referred to as 'Heavy MPCA') comprised of the partially hydrogenated condensation product of formaldehyde and aniline or methyl substituted aniline containing a substantial amount (from 35 to 85% by weight, preferably 40 to 60% by weight) of oligomers in the form of 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14 and 15 aniline or methyl substituted aniline derivatives.

Description

Technical field [0001] The present invention relates to a mixed methylene bridged poly(cyclohexyl aromatic) amine and a preparation method thereof, and relates to an improved epoxy resin cured by a mixed methylene bridged poly(cyclohexyl aromatic) amine and Method of preparing this epoxy resin. Background of the invention [0002] In the past, aliphatic and aromatic polyamines have been used to cure epoxy resins. It is well known that aliphatic amines react with epoxy resins faster than aromatic polyamines. Aliphatic polyamines can be cured at room temperature, while aromatic polyamines generally require more stringent curing conditions or act as accelerator additives. [0003] Describe the application of epoxy resins and aromatic and cycloaliphatic amines as curing agents, so the representative patents including representative hydrogenation methods are listed below: [0004] U.S. 2,817,644 discloses a method of curing and resinizing a polyepoxy compound by reacting a polyepoxy c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/50
CPCC08G59/5026C07C211/49A01K87/00G01B3/004
Inventor M·尤尔曼G·A·维达格D·A·杜博维克S·M·博塞
Owner EVONIK OPERATIONS GMBH
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