Electrode member for plasma treating appts., plasma treating appts. and plasma treating method

A plasma and electrode element technology, applied in the field of plasma treatment, can solve the problems of inability to discharge electrodes, thermal shock damage of discharge electrode plates, etc., and achieve the effects of uniform etching without deviation, uniform injection pressure, and prevention of abnormal discharge

Inactive Publication Date: 2004-08-11
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, because the discharge electrode plate is easily damaged by thermal shock caused by plasma heating, it cannot be used as a discharge electrode directly exposed to plasma

Method used

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  • Electrode member for plasma treating appts., plasma treating appts. and plasma treating method
  • Electrode member for plasma treating appts., plasma treating appts. and plasma treating method
  • Electrode member for plasma treating appts., plasma treating appts. and plasma treating method

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Embodiment Construction

[0051] Next, an embodiment of the present invention will be described with reference to the drawings.

[0052] First, refer to figure 1 The plasma processing apparatus will be described. figure 1Among them, the inner side of the vacuum chamber 1 is a processing chamber 2 for performing plasma processing. The lower electrode 3 (first electrode) and the upper electrode 4 (second electrode) are lined up in the processing chamber 2 for plasma processing. The lower electrode 3 (first electrode) and the upper electrode 4 (second electrode) are vertically opposite to each other in the processing chamber 2 . The lower electrode 3 includes an electrode body 5 which is mounted on the vacuum chamber 1 with a supporting portion 5a through an insulator 9 made of polytetrafluoroethylene to extend downward. A holding part 6 made of high thermal conductivity material such as aluminum, stainless steel or other suitable materials is installed on the upper surface of the electrode body 5, and...

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Abstract

In a plasma treating apparatus, a ceramic porous substance having a three-dimensional network structure in which a frame portion formed of ceramic containing alumina is provided continuously like a three-dimensional network is used for the material of an electrode member for the plasma treating apparatus to be attached to the front surface of a gas supplying port of an electrode for plasma generation, and a gas for plasma generation is caused to pass through a hole portion formed irregularly in the three-dimensional network structure. Consequently, the distribution of the gas to be supplied is made uniform to prevent an abnormal discharge so that uniform etching having no variation can be carried out.

Description

technical field [0001] The invention relates to the front side of a gas supply nozzle of an electrode for generating plasma to be installed in a plasma processing apparatus. Further, the present invention also relates to a plasma processing device using the aforementioned electrode element and a plasma processing method. Background technique [0002] A plasma processing apparatus is well known as an apparatus for polishing electronic devices such as substrates or semiconductor devices. The plasma processing apparatus is used to generate plasma in a vacuum environment, and perform processing (such as etching) on ​​the surface of an object to be physically and chemically processed by using the plasma. Plasma is generated by applying a high-frequency voltage to an electrode within a sealed process chamber. A gas for generating plasma (hereinafter referred to as "gas") having a predetermined pressure is supplied to the processing chamber. [0003] In such a plasma treatment, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05H1/46B01J19/08C23C16/44C23C16/455H01J37/32H01L21/302H01L21/3065
CPCH01J37/3244H01J37/32009H01J37/32532H01L21/3065C23C16/45568
Inventor 有田洁岩井哲博土师宏酒见省二俣野泰司佐藤信博
Owner PANASONIC CORP
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