Electrode member for plasma treating appts., plasma treating appts. and plasma treating method

A plasma and electrode element technology, applied in the field of plasma treatment, can solve the problems of inability to discharge electrodes, thermal shock damage of discharge electrode plates, etc., and achieve the effects of uniform etching without deviation, uniform injection pressure, and prevention of abnormal discharge
CN1520604AInactive Publication Date: 2004-08-11PANASONIC CORP

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
PANASONIC CORP
Publication Date
2004-08-11
Estimated Expiration
Not applicable · inactive patent

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Abstract

In a plasma treating apparatus, a ceramic porous substance having a three-dimensional network structure in which a frame portion formed of ceramic containing alumina is provided continuously like a three-dimensional network is used for the material of an electrode member for the plasma treating apparatus to be attached to the front surface of a gas supplying port of an electrode for plasma generation, and a gas for plasma generation is caused to pass through a hole portion formed irregularly in the three-dimensional network structure. Consequently, the distribution of the gas to be supplied is made uniform to prevent an abnormal discharge so that uniform etching having no variation can be carried out.
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Description

technical field

[0001] The invention relates to the front side of a gas supply nozzle of an electrode for generating plasma to be installed in a plasma processing apparatus. Further, the present invention also relates to a plasma processing device using the aforementioned electrode element and a plasma processing method. Background technique

[0002] A plasma processing apparatus is well known as an apparatus for polishing electronic devices such as substrates or semiconductor devices. The plasma processing apparatus is used to generate plasma in a vacuum environment, and perform processing (such as etching) on ​​the surface of an object to be physically and chemically processed by using the plasma. Plasma is generated by applying a high-frequency voltage to an electrode within a sealed process chamber. A gas for generating plasma (hereinafter referred to as "gas") having a predetermined pressure is supplied to the processing chamber.

[0003] In such a plasma treatment, ...

Claims

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