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Method and apparatus for underfilling electronic components using vacuum assist

An underfill, vacuum channel technology, applied in electrical components, household components, electric solid devices, etc., can solve the problems of reliability impact of final products, weakening of the overall structure, etc.

Inactive Publication Date: 2004-09-01
NORDSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The presence of voids within the encapsulation material weakens the overall structure and has a negative impact on the reliability of the final product

Method used

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  • Method and apparatus for underfilling electronic components using vacuum assist
  • Method and apparatus for underfilling electronic components using vacuum assist
  • Method and apparatus for underfilling electronic components using vacuum assist

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0046] figure 1 One embodiment of the present invention is schematically shown for underfilling a gap between a substrate 10 and an integrated circuit chip or die 12 . Substrate 10 may comprise an organic or ceramic substrate material, such as a printed wiring board, a multi-chip flip-chip module, or a flip-chip carrier. The gap 13 between the chip 12 and the substrate 10 is seen more clearly in FIGS. 3 and 4 , the gap 13 being formed by electrically conductive solder bumps 14 electrically and mechanically connecting the chip 12 to the substrate 10 .

[0047] figure 1 Also shown is a liquid encapsulant material 16 applied to the substrate 10 in L-shaped beads along the two side edges of the chip 12 . Tool 18 is positioned along opposite side edges of chip 12 so that tool 18 contacts, ie rests on, substrate 10 . The tool 18 can preferably extend along the two side regions of the chip 12 . As such, it is preferred that the tool 18 is generally L-shaped, although other config...

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PUM

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Abstract

A bead of liquid encapsulant or underfilled material (16) is dispensed along one or more edges of the flip chip (12). A plenum is located along the sides of the chip (12) in which encapsulant or underfilled material has not been deposited, such as opposite the dispensed material. Thereafter, the plenum is subject to a negative pressure source for drawing a vacuum to the area beneath the chip (12) and the substrate (10). The negative pressure aids in the natural capillary underfilling action and for quicker and more effective underfilling of the chip. Simultaneous underfilling of a plurality of chips (12) can be achieved by mounting a like plurality of vacuum tools to a plate which is moved into registration with a like plurality of chip / substrate workstations. By operatively connecting the vacuum tools to a controller, and to appropriate valves which can be set to adjust the vacuum level.

Description

technical field [0001] The present invention relates to a dispensing and dispensing system for substrate material. In particular, the present invention relates to the dispensing of liquid materials used in the manufacture of semiconductor packages. More particularly, the present invention relates to a method and apparatus for underfilling a semiconductor device mounted on a substrate, such as a wiring board. technical background [0002] In the electronics industry, it is common to electrically and mechanically assemble semiconductor devices, that is, to mount an integrated circuit chip onto a substrate. Such a structural arrangement is commonly referred to as "flip-chip". "Flip chip" is assembly within a wafer shape using electrically conductive contacts, or bond pads, directly up. Each "flip-chip" semiconductor device is then separated from the wafer and flipped over so that the now upward direct electrical contacts can be electrically connected to corresponding contact...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56B29C70/84
CPCB29L2031/3406B29C70/84H01L2224/73204H01L2224/743H01L2224/92125H01L21/56
Inventor B·休伊D·N·帕吉特H·基尼奥内斯
Owner NORDSON CORP