Repeatedly bend heat conducting & radiating module group with flexible pivot

A heat dissipation module and hub technology, applied in semiconductor devices, semiconductor/solid-state device parts, instruments, etc., can solve the problems of high cost, power consumption, poor thermal conductivity, etc., and achieve better thermal conductivity and low manufacturing cost. Effect

Inactive Publication Date: 2004-11-24
LIOU JIUN-FU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The present invention mainly aims to solve the problems of high cost, power consumption, and poor heat conduction effect of traditional cooling devices installed in notebook computers or palm-type input devices.

Method used

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  • Repeatedly bend heat conducting & radiating module group with flexible pivot
  • Repeatedly bend heat conducting & radiating module group with flexible pivot
  • Repeatedly bend heat conducting & radiating module group with flexible pivot

Examples

Experimental program
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Effect test

Embodiment Construction

[0018] refer to figure 1 As shown, the heat conduction and heat dissipation module provided by the present invention includes a heat-receiving end device 1 , a heat-dissipating device 2 and a flexible heat-conducting device 3 ; the heat-receiving end device 1 further includes a heat source 11 and a first base 13 One or more heat pipes and bodies 12 are connected between the first base 13 and the heat source 11, and a part of the heat pipes and bodies 12 are embedded or fixed between the heat source 11 and the first base 13 above; its embedding or fixing method can be completed by techniques such as die-casting, casting, welding, locking, welding or pressing. The heat source 11 and the first base 13 are made of materials with good thermal conductivity.

[0019] The heat dissipation end device 2 further includes a second base 23 and a heat sink 21, and one or more than two heat pipes and bodies 22 are connected between the second base 23 and the heat sink 21; and the heat pipe,...

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PUM

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Abstract

The flexible heat conducting and dissipating module includes one heat accepting end device, one heat dissipating end device and one flexible heat conducting device. The heat accepting end device is heat conducting tube or other heat conducting body connected between the heat source and the first pedestal; the heat dissipating end device is heat conducting tube or other heat conducting body connected between the heat dissipater and the second pedestal; and the flexible heat conducting pipe is connected between the first pedestal and the second pedestal to constitute closed loop. The flexible heat conducting pipe is filled with heat conducting liquid, and after absorbing heat in the heat accepting end, the heat conducting liquid forms heat convection inside the flexible pipe to conduct heat to the heat dissipating end. In this way, heat is transferred and dissipated via flexible path.

Description

technical field [0001] The present invention relates to a heat dissipation module used in information, communication or other products, especially a heat conduction and heat dissipation module with soft hinges and repeatable bending, which can transfer heat through frequently changing paths for heat dissipation. mod. Background technique [0002] At present, most of the heat dissipation devices used by the industry for computer central processing units (CPU) or high heat source products use metal heat sinks with high heat transfer efficiency. The base of the heat sink is in contact with the heat source to absorb and transfer heat to On the fins of the heat sink, use the fan to blow out cold air to remove the heat on the heat sink. [0003] This method is effective for the small heat generated by the small CPU, but it cannot effectively and quickly achieve the heat dissipation effect for the large amount of heat generated by the large CPU with faster and faster computing spe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20H01L23/36
Inventor 刘俊富
Owner LIOU JIUN-FU
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