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Ceramic heater

A ceramic heater and ceramic technology, applied in the field of conductive paste, can solve the problems that the temperature of the heater substrate cannot quickly keep up with the change of voltage or current, poor temperature control characteristics, etc.

Inactive Publication Date: 2004-11-24
IBIDEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method has a problem that, due to the thickness of the metal plate, the temperature of the heater substrate cannot quickly follow the change in voltage or current, and the temperature control characteristics are poor.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example

[0118] (Example 1) The heater is composed of an aluminum nitride ceramic substrate

[0119] (1) Using the spray drying method, a mixture of 100 parts by weight of aluminum nitride powder (average particle size of 1.1 microns), 4 parts of yttrium oxide (average particle size of 0.4 microns), 12 parts of acrylic binder and alcohol Made into granular powder.

[0120] (2) The granulated powder is put into a mold and formed into a flat plate to obtain a green sheet shape. This green sheet is drilled with a drill to form through-holes 8 for inserting support pins of the semiconductor wafer and recesses (not shown) for embedding thermocouples.

[0121] (3) at 200kg / cm 2 Under the pressure of 1800° C., the green sheet was hot-pressed to obtain an aluminum nitride plate with a thickness of 3 mm. It was cut into discs with a diameter of 210 mm to form a ceramic plate body (ceramic substrate) 1 .

[0122] (4) Conductive paste is screen-printed on the ceramic substrate 1 obtained in (...

example 3

[0130] Regarding the heaters of Examples 1 and 2, the temperature responsiveness and tensile strength of the heating surface of the ceramic substrate were measured when the power supply or current of the heating body 2 was changed, that is, when a voltage was applied to each heater, the heating of Example 1 was observed. The temperature change of the heater within 0.5 seconds, and the temperature change of the heater in observation example 2 within 2 seconds. On the other hand, the tensile strengths of the heating body 2 are respectively: 3.1 kg / mm ​​in the heater of Example 1 2 , Example 2 heater 3kg / mm 2 .

[0131] (Example 4) A heater with a heating body installed inside it ( image 3 , 5)

[0132] (1) Using a doctor blade, 100 parts by weight of aluminum nitride powder (manufactured by Tokuyama Corporation, with an average particle size of 1.1 μm), 4 parts of yttrium oxide (with an average particle size of 0.4 μm), 11.5 parts of an acrylic binder, A mixture of 0.5 part...

example 5

[0149] The same procedure as in Example 4 was basically repeated except that the heating body was not flat but had a cross-section of 20 microns thick by 20 microns wide square (aspect ratio of 1).

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Abstract

A ceramic heater is featured as that heater which is formed by sintered metal granules and metal oxide if necessary is set on surface or in internal of ceramic base plate structured by nitride ceramic or carbide ceramic. In addition, paste made of mixed metal granules and metal oxide is used as electric conducting paste.

Description

[0001] This application is a divisional application of an invention patent with an application date of June 9, 1999, an application number of 99800862.1, and an invention title of "ceramic heater, its manufacturing method, and conductive paste for heating body". technical field [0002] The invention relates to a ceramic heater for drying in the semiconductor industry, in particular to a thin and light ceramic heater helpful for temperature control, its manufacturing method and a conductive paste for forming a heating element of the heater. Background technique [0003] Generally, a silicon wafer is coated with a corrosion resist and then etched to manufacture general semiconductor products. In this case, the photosensitive resin applied on the surface of the silicon wafer should be dried after the application. Regarding the drying method, generally, a silicon wafer coated with a resin is placed on a heater and then heated. [0004] As for such a heater, generally, a heatin...

Claims

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Application Information

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IPC IPC(8): H05B3/12H05B3/26H05B3/28
Inventor 古川正和平松靖二伊藤康隆
Owner IBIDEN CO LTD
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