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41results about How to "Improve heating characteristics" patented technology

Method of making coated articles and coated articles made thereby

A method of making a coated substrate includes providing a substrate having a functional coating with a first emissivity value; depositing a coating material having a second emissivity value over at least a portion of the functional coating prior to heating to provide a coating stack having an emissivity value greater than the emissivity value of the functional coating; and heating the coated substrate.
Owner:VITRO FLAT GLASS LLC

Warming tool in a sheet form

A warming device of sheet form having (1) a heat generating sheet prepared by papermaking and containing an oxidizable metal, a moisture retaining agent, and a fibrous material and (2) an air permeable holder holding the heat generating sheet. The warming device has a thickness of 0.1 to 10 mm and a flexural strength of 0.01 to 0.3 N / cm. The sheet preferably has a thickness of 0.1 to 2.0 mm. The fibrous material preferably has a CSF of 600 ml or less.
Owner:KAO CORP

Method for the purification of diesel engine exhaust gases

ActiveUS20150231565A1Reduce ASCAvoid secondary emissionsGas treatmentInternal combustion piston enginesNitrogen monooxideNitrogen dioxide
A method in which the exhaust gas that is to be purified is passed through an exhaust-gas line containing a diesel oxidation catalyst (DOC) for the oxidation of residual gaseous hydrocarbons (HC) and carbon monoxide (CO) in order to form carbon dioxide (CO2) and for the at least proportional oxidation of the nitrogen monoxide (NO) contained in the exhaust gas in order to form nitrogen dioxide (NO2) is provided.
Owner:DEUTZ AG

Novel LED and a high-power radiator of a radiating element

The invention relates to a novel LED and a high-power radiator of a radiating element, comprising flat plate heat pipes which are of two or more via-hole array flat plate structures arranged side by side; the via-hole array flat plate structures are formed by carrying out extrusion or punch forming on metal materials; the equivalent diameter of the via hole is 0.5-3mm; the via hole is filled with liquid propellant and both ends of the flat plate heat pipes are packaged by sealing; an evaporation section of the flat plate heat pipe contacts heating surfaces of the LED and the high-power radiating element and a condensation section thereof radiates through the radiating element. The novel LED and the high-power radiator of a radiating element overcome the disadvantages that the contact area of the existing circular heat pipes and the heating surfaces of the LED and the high-power radiating element is small, the equivalent resistance of heat conduction is large and the manufacturing process is complex, which have the advantages of high radiating efficiency and simple process.
Owner:GUANGWEI HETONG ENERGY TECH BEIJING CO LTD

Linear motor, exposure apparatus using the same, and device manufacturing method

InactiveUS20050134122A1Shorten apparent slot pitchImproved in heat generation characteristicManufacturing dynamo-electric machinesPhotomechanical exposure apparatusEngineeringLinear motor
In a movable magnet-type linear motor including a stator 10 having a plurality of iron core elements 1 arranged at a certain slot pitch and a movable part 20 having a magnet 3 which is movable in an arrangement direction, a single or a plurality of pseudo-slots 6 are provided between adjacent slots 5 and the iron core element and the magnet are relatively skewed by an approximately apparent slot pitch including the pseudo-slot, whereby cogging becomes substantially zero to improve a heat generation characteristic.
Owner:CANON KK

Internal combustion engine

An internal combustion engine, including at least one exhaust-gas line having at least one device for the after-treatment of the exhaust gas and at least one urea-water solution tank, whereby the urea-water solution tank 3 is located close to the engine, is provided.
Owner:DEUTZ AG

Electronic part mounting heat-dissipating substrate

[Problem] An object of the present invention is to provide an electronic part mounting heat-dissipating substrate which enables a circuit for which a power semiconductor in which a large current flows is used to reduce the wiring resistances of a large power operation and improve the heat dissipation.[Means for Solving] The present invention is an electronic part mounting heat-dissipating substrate which comprises lead frames of wiring pattern shapes formed by conductor plate and an insulating member 130 which is provided between the lead frames 110, wherein a plate surface of a part arrangement surface of said conductor plate and a top surface of said insulating member at a side of said part arrangement surface form one continuous surface, the lead frames have different thicknesses, the thick lead frame 110H is used for a large current signal and the thin lead frame 110L is used for a small current signal, a plate surface of a back surface of the part arrangement surface and a top surface of the insulating member at a side of the back surface at the part arrangement surface-side are formed in an identical plane.
Owner:NSK LTD

Exothermic enamel glaze, and exothermic container coated with same

The present invention relates to an exothermic container to be used in a microwave oven which cooks foods using a magnetron. The exothermic container absorbs a portion of the microwaves generated by the magnetron and generates heat to cook foods in the cooking chamber of the microwave oven. The exothermic container to be used in the microwave oven is produced by the steps of providing an exothermic enamel glaze, coating a metal container to be produced into an enameled container (low carbon steel plate, aluminum, and stainless steel to be produced into an enameled container) with the exothermic enamel glaze provided in the previous step, drying the resulting structure, firing the resulting structure to vitrify same, and cooling the resulting structure, to thereby achieve improved resistance against hot temperatures, improved exothermic performance,; and higher quality as compared to conventional exothermic container products (silicon rubber and ferrite). A method for producing the exothermic enamel glaze involves mixing or adding (MnZn-based, MgCuZn-based, NiZn-based) ferrite, having high magnetic permeability, and alloy powders of (Fe-Si-based, Fe-Si-Al-based, Fe-Si-B-based, Fe-Si-B-Co-based, Fe-Ni-based, etc.) soft magnetic metal materials to the glaze (glass frit) commonly used in enameling, to thereby provide the glaze with exothermic properties for absorbing microwaves (2.45GHz) and for converting the absorbed microwaves into thermal energy in a microwave oven.
Owner:YOU&I TECH

Metal nanowire heater and method of fabricating the same

Provided is a method of fabricating a metal nanowire heater, the method including a coating step of coating, on a substrate, a coating film containing laser-etchable and low-melting-point metal nanowires, a thermal joining step of enhancing connection between contact parts of the metal nanowires due to a chemical and physical action occurring when an ionic liquid is phase-changed, by supplying the ionic liquid onto the coating film and applying heat from outside, and an electrode forming step of forming electrodes on the coating film.
Owner:KOREA INST OF SCI & TECH

High-energy-efficiency piezoelectric ultrasonic transducer and end cover thereof

The invention discloses a high-energy-efficiency piezoelectric ultrasonic transducer and an end cover thereof. The whole end cover is arranged to be of a cylinder structure and comprises an end cover front, an end cover middle and an end cover tail which are arranged coaxially. The end cover front is provided with an output end face. The end cover tail is provided with a fixing part. The end cover middle is of a combined hollow structure and comprises a cross-section transition section. The cross-section transition section is in a circular truncated cone shape or a right trapezoidal platform shape. A large end with the large area and a small end with the small area serve as the two ends of the cross-section transition section. The large end of the cross-section transition section is connected with the end cover tail. The small end of the cross-section transition section is connected with the end cover front. The outer wall of the cross-section transition section is supported on the end cover front by means of a plurality of rib plates uniformly distributed in the peripheral direction. Thus, by reasonably designing mass distribution of the end cover of the transducer, the mass load of the output end face is reduced, in comparison with a traditional solid end cover, by means of the overall arrangement, under the same input power, the amplitude of the output end face can be increased, and the output efficiency is improved beneficially.
Owner:NANJING UNIV OF AERONAUTICS & ASTRONAUTICS

Heat pump type hot-water heating apparatus

PROBLEM TO BE SOLVED: To improve heating property at starting operation by giving priority to a heating side in distributing compressor capability at the beginning of starting hot water storing operation and heating operation at the same time while sorting refrigerant into both a hot water storage water refrigerant heat exchanger and a heating side water refrigerant heat exchanger.SOLUTION: This heat pump hot water supply heating device comprises a hot water storage side heat pump refrigerant circuit TR, a heating side heat pump refrigerant circuit DR, a hot water storage circuit C2 for circulating hot water in a hot water storage tank 31 for boiling-up, a heating circuit C1 for circulating heating hot water into a heating terminal for heating operation, and a control device S1 for controlling the openings of a hot water storage side flow control valve 27 and a heating side flow control valve 26 to sort the flow of the refrigerant from a compressor into the hot water storage heat pump refrigerant circuit and the heating side heat pump refrigerant circuit. The control device makes the opening of the heating side flow control valve in the heating side heat pump refrigerant circuit greater than the opening of the hot water storage side flow control valve in the hot water storage side heat pump refrigerant circuit at the beginning of starting hot water storing operation and heating operation at the same time.
Owner:SANYO ELECTRIC CO LTD +1

Organic light emitting diode display

An organic light emitting diode display includes: display area where an image is not displayed, the non-display area including a first driver IC; a touch module above the display module and including a second driver IC; a first flexible printed circuit board (PCB) connected to the first driver IC; and a second flexible printed circuit board (PCB) connected to the second driver IC and including an extension configured to be in contact with the first driver IC.
Owner:SAMSUNG DISPLAY CO LTD

Method of solving problem of photovoltaic energy consumption by using heat storage system

The invention discloses a method of solving the problem of photovoltaic energy consumption by using a heat storage system. The traditional coal-fired heating is changed into electric heating in a photovoltaic surplus area to break the rigid constraint of "ordering power by heat" of a coal-fired co-generation unit, and the space for photovoltaic consumption can be effectively increased. On the basis of electric heating, a heat storage system is adopted, the photovoltaic output characteristics, load characteristics and electricity prices are taken into account, minimizing the cost of heat-supply enterprises in a scheduling cycle is taken as the goal, the scheduling heat storage operation state is optimized, the heat supply characteristics of the heat-supply enterprises are improved from the time dimension, the level of photovoltaic energy consumption is further enhanced and meanwhile the economic benefits of the heat-supply enterprises are ensured.
Owner:SHANGHAI ELECTRIC POWER DESIGN INST

Heating apparatus for a MEMS sensor

A heating apparatus for a MEMS sensor, comprising a metallic supply lead element for electric current; a metallic return lead element for electric current; and a defined number of metallic heating elements configured between the supply lead element and the return lead element, a substantially constant electrical current density being configurable in the supply lead element, in the return lead element, and in the heating elements.
Owner:ROBERT BOSCH GMBH

Radio-frequency module

A semiconductor device including a radio-frequency amplifier circuit and a band selection switch is mounted on or in a module substrate. An output matching circuit coupled between the radio-frequency amplifier circuit and the band selection switch is on or in the module substrate. The semiconductor device includes a first member at which the band selection switch having a semiconductor element made of an elemental semiconductor is formed and a second member joined to the first member in surface contact therewith. The radio-frequency amplifier circuit including a semiconductor element made of a compound semiconductor is formed at the second member. Conductive protrusions are raised from first and second members. The semiconductor device is mounted on or in the module substrate with the conductive protrusions interposed therebetween, and in plan view, is in close proximity to the output matching circuit or overlaps a passive element constituting the output matching circuit.
Owner:MURATA MFG CO LTD

Ceramic heater

A ceramic heater is featured as that heater which is formed by sintered metal granules and metal oxide if necessary is set on surface or in internal of ceramic base plate structured by nitride ceramic or carbide ceramic. In addition, paste made of mixed metal granules and metal oxide is used as electric conducting paste.
Owner:IBIDEN CO LTD

Linear motor, exposure apparatus using the same, and device manufacturing method

In a movable magnet-type linear motor including a stator having a plurality of iron core elements arranged at a certain slot pitch and a movable part having a magnet 3 which is movable in an arrangement direction one or more pseudo-slots are provided between adjacent slots, and the iron core element and the magnet are relatively skewed by an approximately apparent slot pitch including the pseudo-slot.
Owner:CANON KK

Exothermic enamel glaze, and exothermic container coated with same

The invention relates to a heating container used in a microwave oven using a magnetron to cook food. The heating container absorbs a part of the high-frequency wave generated by the magnetron and generates heat, and uses the high-frequency wave to cook the food in the cooking room of the microwave oven. In the present invention, the exothermic enamel glaze is produced, and the above-mentioned manufactured exothermic enamel glaze is coated on a container made of metal material for enamel (steel plate for low-carbon enamel, aluminum, stainless steel), dried, and then vitrified and fired. , cooling, and produce a heating enamel container for microwave ovens. Therefore, compared with existing heating container products (silicone rubber + ferrite), it can withstand high temperatures, has higher heating performance, and can achieve high-grade. The method for manufacturing the heat-generating enamel glaze is characterized in that, in the glaze (vitreous Frit) commonly used in enamel treatment, ferrites with high magnetic permeability (MnZn class, MgCuZn class, NiZn class, etc.) are added separately or mixed. type) and metal soft magnetic material (Fe-Si type, Fe-Si-Al type, Fe-Si-B type, Fe-Si-B-Co type, Fe-Ni type) alloy powder to produce A heat-generating enamel glaze that absorbs microwaves (2.45GHz) in a microwave oven and converts them into heat energy.
Owner:YOU&I TECH

Backlight unit and display device

A backlight unit and a display device including the backlight unit are discussed. By arranging at least one electronic element for driving a light source and the backlight unit on a surface where the light source is disposed in a printed circuit and arranging a pattern having a reflective characteristic in an area where the electronic element is disposed, an image quality of the backlight unit can be maintained and a design structure of the backlight unit can be simplified. In addition, the light source and the electronic element can be disposed on a same surface of the printed circuit so that a space is not present between an opposite surface of the surface of the printed circuit where the light source is disposed and a cover bottom, so the performance of a heat dissipation can be improved in an area where the light source or the electronic element overlaps.
Owner:LG DISPLAY CO LTD
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