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Method for the production of thin layer chip resistors

一种薄膜芯片、电阻的技术，应用在电阻器、电阻制造、涂敷电阻材料等方向，能够解决单个电阻或电阻线路花费的时间长等问题

Inactive Publication Date: 2004-12-01
BC COMPONENTS HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of this method, despite its price advantage, is the lengthy time it takes to sequentially process individual resistors or resistor lines due to the absence of photolithography and thick film contacts

Method used

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  • Method for the production of thin layer chip resistors
  • Method for the production of thin layer chip resistors
  • Method for the production of thin layer chip resistors

Examples

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Embodiment Construction

[0024] figure 1 The pregrooved, laser-scored or sawn substrate 10 which is preferably used in the production method according to the invention is reproduced in a perspective partial cutaway. The substrate 10 is made of, for example, glass, silicon, SiO, or an insulating ceramic such as Al 2 o 3 or AIN form. The upper side is divided into individual regions 13 by grooves 11 , 12 arranged perpendicularly to one another along a grid, in each region forming a thin-film chip resistor. The substrate 10 can also be sawn, or scribed with a laser, or not separated at all. Resistor arrays or resistor networks can also be formed according to the above divisions.

[0025] FIG. 2 again shows a longitudinal section of the substrate 10 on which a resistive layer 14 is first applied according to FIG. 3 , preferably over the entire surface of the substrate. The resistive layer 14 is usually a suitable resistive alloy, such as a metal layer composed of CrNi, CrSi, TaN, CuNi. The resistive...

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Abstract

A method for manufacturing thin-film chip resistors, in which method a resistor layer ( 14 ) and a contact layer ( 15, 16 ) are applied onto the upper surface of a substrate ( 10 ) and structured using laser light so as to form on said substrate ( 10 ) a plurality of adjacent, separate resistor lands ( 24 ) having a predetermined approximate resistance value, allows the simplified and cheap manufacturing by performing the electrical insulation of the resistor elements ( 24 ) and the structuring of the individual resistor lands ( 24 ) for the entire resistor land simultaneously by means of a laser-lithographic direct exposure method.

Description

technical field [0001] The invention relates to the field of producing passive electronic components. It relates to a method for producing thin-film chip resistors according to the preamble of claim 1 . [0002] One such method is known for example from US-A-5976392. Background technique [0003] Known are methods for producing thick-film resistors in which the resistive layer and the contact layer are applied structured as paste by means of screen printing. Very inexpensive components can be produced by this method. [0004] Furthermore, methods are known for producing thin-film resistors or thin-film chip resistors, in which the resistive layer and the contact layer are applied by means of sputtering / evaporation and subsequently structured using a photolithographic process. Components produced in this way are usually of higher quality. But its disadvantage is that the production cost is high. [0005] The document US-A-5976392 mentioned at the outset describes a metho...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01C17/06H01C17/00H01C17/242
CPCH01C17/242H01C17/006Y10S430/146H01C17/003Y10S438/94
Inventor 沃尔夫冈·韦纳霍斯特·沃尔夫雷纳·W.·科尔
Owner BC COMPONENTS HLDG
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