Silicon based micro passage heat exchanger

Abstract

The invention discloses a silicon based micro passage heat exchanger for the heat-sink cooling of high heat flow density electronic components, wherein a plurality of micro passages composed of multiple longitudinal passages along the cooling liquid flow direction and multiple transverse micro passages spaced by a predetermined distance along the direction perpendicular to the flow direction are etched on the silicon substrates of the semiconductor, the longitudinal micro passages and the transverse passages forming crossing micro passage array, and packaging the micro passages with heat resistant glass. The invention can be applied to link the micro pump, connecting pipe with the silicon based micro passage heat exchanger so as to form a forced-circulation return circuit.

Description

technical field [0001] The invention relates to a micro-channel heat exchanger used as a heat radiation cooling device for electronic components. Especially silicon-based microchannel heat exchangers for heat dissipation and cooling devices for integrated IC electronic components with high heat flux. Background technique [0002] In recent years, with the rapid development of the information industry, the integration of transistors has been greatly improved, and the heat flux per unit area has also increased. Therefore, the heat dissipation technology of electronic components has become the bottleneck of the development of the information industry, and the heat dissipation technology of electronic components has become an important branch of electronic packaging technology. . Foreign countries have paid considerable attention to the heat dissipation technology of electronic components, and formed a new interdisciplinary subject of electronics and machinery. [0003] Microc...

AI Technical Summary

Problems solved by technology

The disadvantage of the existing silicon-based microchannel heat sinks is that most of the silicon-based microchannels use parallel microchannel arrays. When the fluid enters the microchannel, the flow boundary layer and thermal boundary layer develop simultaneously, and the thermal boundary layer has not yet reached In the fully developed area, the heat transfer coefficient and Nusselt number are large, but as the flow expands, the heat transfer coefficient and Nusselt number decrease rapidly, so the silicon-based microchannel heat dissipation of this parallel microchannel array structure The sink's cooling effect is limited

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