Package for electronic parts, lid thereof, material for the lid and method for producing the lid material

Abstract

A lid material (1) according to the present invention comprises: a base layer (2) composed of a low thermal expansion metal; an intermediate metal layer (3) provided on one surface of the base layer (2) and composed of a low proof stress metal having a proof stress of not greater than 110 N / mm<2>; and a brazing material layer (4) provided on the intermediate metal layer (3) and composed of a silver brazing alloy mainly comprising silver. The intermediate metal layer (3) and the brazing material layer (4) are press- and diffusion-bonded to each other, and the brazing material layer (4) has a blistered area ratio of not greater than 0.5% as observed on an outer surface of the brazing material layer. The low proof stress metal is preferably oxygen-free copper. A lid produced from the lid material (1) exhibits an excellent bonding property when the lid is brazed to a case mainly composed of a ceramic material for an electronic component package. Further, the lid suppresses the breakage of the case, and ensures excellent brazing workability.

Description

technical field [0001] The present invention relates to a package for electronic components in which an opening of a case housing electronic components is sealed by a lid, the lid, and a lid material used as a raw material thereof. Background technique [0002] As disclosed in Japanese Unexamined Patent Application Publication No. 2000-3973 (Patent Document 1), a package for accommodating various electronic components such as a semiconductor element and a piezoelectric vibrator includes a case for accommodating electronic components with a concave portion opened on the upper surface thereof, and The cover body is welded to the outer peripheral portion of the opening of the case body so as to seal the concave portion and to block the opening portion of the case body. [0003] The aforementioned box body is formed of ceramics such as alumina or aluminum nitride as a main material. On the other hand, the cover body includes a base material layer formed of a low thermal expansi...

AI Technical Summary

Problems solved by technology

[0009] In the technology disclosed in Patent Document 2, it is recorded that copper foil is used as the deformation absorbing material of the cap or cap positioning device. Effective in preventing breakage of the plate-like substrate, but not sufficiently effective in preventing breakage of the thin-walled part of the miniaturized case

In addition, it is described that the copper foil is soldered to both sides of the substrate and the cap, but the soldering workability is poor, and the productivity of the package is also low.

[0010] On the other hand, in the technology disclosed in Patent Document 3, since the Ni-based metal and the solder material are laminated, only pressure bonding is performed, and there is no diffusion bonding. There are joint problems between the two layers when welding consumables

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