Thermally enhanced component substrate

A technology for substrates and heat-conducting components, applied in semiconductor/solid-state device parts, electrical components, electric solid-state devices, etc.
CN1574308AInactive Publication Date: 2005-02-02NOKIA TECHNOLOGLES OY
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
NOKIA TECHNOLOGLES OY
Publication Date
2005-02-02
Estimated Expiration
Not applicable · inactive patent

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Abstract

An IC package dissipates thermal energy using thermally and electrically conductive projections. The IC package includes a substrate material with a die pad area, which is suitable to support an integrated circuit. A plurality of solder ball pads is disposed on a first surface of the substrate material and a plurality of conductive projections radiate outwardly from the die pad area and extend to cover a corresponding selected solder ball pad to facilitate the dissemination of thermal energy from the die pad area to the substrate and / or printed wiring board.
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Description

technical field

[0001] The present invention generally relates to the removal of thermal energy (heat) from a die pad. More specifically, the present invention relates to thermally enhanced substrates that reduce thermal resistance of circuit packages and integrate heat dissipation and electrical conductivity to specific pins. Background technique

[0002] To more efficiently use real estate on printed wiring boards (PWBs) and printed circuit boards (PCBs), semiconductor chip manufacturers have moved from packages such as pin grid arrays ("PGAs") and perimeter-leaded square planar packages ("QFPs") to The transition from larger, more cumbersome interconnect technologies of the same type to smaller assemblies, such as ball grid arrays ("BGAs"). Using BGA technology, semiconductor chips are typically interconnected to their supporting substrates using solder connections. However, the solder posts are usually designed to be relatively short to maintain the integrity of the so...

Claims

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