Thermally enhanced component substrate

A technology for substrates and heat-conducting components, applied in semiconductor/solid-state device parts, electrical components, electric solid-state devices, etc.

Inactive Publication Date: 2005-02-02
NOKIA TECHNOLOGLES OY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

One disadvantage of varying the thickness of the heat spreader to dissipate heat is that it requires special manufacturing steps to produce the desired shape of the heat spreader

Method used

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Examples

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Embodiment Construction

[0024] For both integrated circuit packages and MCM components, the present invention addresses the need to make the thermally active area from the die to the printed circuit board (PCB) The thermal resistance is minimized. The present invention is particularly useful in applications requiring enhanced thermal passage from the die to the solder balls, especially in applications where there is no overlap between the die and the solder balls, such as in BGA (Ball Grid Array ) packages without center ball peripheral pins (for example, Tessera uBGA, STLF- and TFBGA, etc.).

[0025] The present invention integrates thermal and electrical functions into the same pin. In particular, I / O pins that do not overlap the die can be thermally connected to the die by using a thermally conductive element, such as copper, between the pin and the underside of the die. A pin can be under the die, or it can be a peripheral pin. The central heat bulb can also have an electrical function. Thus,...

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Abstract

An IC package dissipates thermal energy using thermally and electrically conductive projections. The IC package includes a substrate material with a die pad area, which is suitable to support an integrated circuit. A plurality of solder ball pads is disposed on a first surface of the substrate material and a plurality of conductive projections radiate outwardly from the die pad area and extend to cover a corresponding selected solder ball pad to facilitate the dissemination of thermal energy from the die pad area to the substrate and/or printed wiring board.

Description

technical field [0001] The present invention generally relates to the removal of thermal energy (heat) from a die pad. More specifically, the present invention relates to thermally enhanced substrates that reduce thermal resistance of circuit packages and integrate heat dissipation and electrical conductivity to specific pins. Background technique [0002] To more efficiently use real estate on printed wiring boards (PWBs) and printed circuit boards (PCBs), semiconductor chip manufacturers have moved from packages such as pin grid arrays ("PGAs") and perimeter-leaded square planar packages ("QFPs") to The transition from larger, more cumbersome interconnect technologies of the same type to smaller assemblies, such as ball grid arrays ("BGAs"). Using BGA technology, semiconductor chips are typically interconnected to their supporting substrates using solder connections. However, the solder posts are usually designed to be relatively short to maintain the integrity of the so...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/498
CPCH01L2924/01046H01L24/48H01L2924/01068H01L2924/15173H01L2224/48227H01L2924/15311H01L23/49827H01L2224/48228H01L2924/01078H01L23/3677H01L2224/48091H01L2924/01087H01L2224/73265H01L2224/32225H01L24/49H01L24/73H01L2224/05599H01L2224/45099H01L2224/48237H01L2224/49175H01L2224/85399H01L2924/00014H01L2924/14H01L2924/181H01L2924/00012H01L2924/00H01L2224/45015H01L2924/207
Inventor J·T·努尔米宁
Owner NOKIA TECHNOLOGLES OY
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