Flexible metal foil-polyimide laminate and making method

A technology of polyimide layer and laminated material, applied in metal layered products, printed circuit manufacturing, circuit substrate materials, etc., can solve problems such as uneconomical, achieve low lamination temperature, high adhesive strength, low drying effect of temperature

Inactive Publication Date: 2005-09-28
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, due to the need for thermocompression bonding of the cured polyimide, this method is not economical because it requires specialized equipment that can be heated above the Tg of the polyimide

Method used

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  • Flexible metal foil-polyimide laminate and making method

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Experimental program
Comparison scheme
Effect test

Embodiment 1-4

[0031] Laminate Preparation

[0032] The polyamic acid varnish prepared above was coated on a rolled copper foil test piece with a thickness of 30 cm x 25 cm and a thickness of 35 microns by using an applicator, and the thickness of the wet coating was 30 microns. The coating was dried in a 120°C oven for 2 minutes. A 30 cm x 25 cm, 25 micron thick polyimide film as listed in Table 1 was laminated over the varnish coat. Pressure lamination was carried out using a test roll laminator (Nishimura Machinery Co., Ltd.) at 120°C and a pressure of 15 kg / cm at a rate of 4 m / min. The laminated coupons were heat treated continuously at 160°C for 4 hours, at 250°C for 1 hour, and then at 350°C for 1 hour in a nitrogen-filled oven. The resulting laminate consisted of a 35 micron thick copper foil and a 28 micron thick polyimide layer (adhesive layer + polyimide film).

[0033] DMAc transmittance of polyimide film

[0034] Such as figure 1 As shown, DMAc indicated by 2 has been poured...

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Abstract

A flexible metal foil-polyimide laminate is prepared by applying a dimethylacetamide solution of polyamic acid onto a metal foil, drying the applied solution to form a semi-dry adhesive layer, laminating a polyimide film thereto on a hot roll press, and heat curing for solvent removal and imidization. The polyimide film has a dimethylacetamide gas permeability of at least 0.1 kg / m2.hr at 5 Torr and 200 DEG C. In the heat curing step, the residual solvent and the water formed upon imidization in the adhesive layer are removed through the polyimide film.

Description

technical field [0001] This invention relates to flexible metal foil-polyimide laminates and methods of making such laminates using lamination techniques. In particular, the present invention relates to a flexible metal foil-polyimide laminate in which a heat-resistant polyimide film is laminated on one surface of the metal foil via a heat-resistant adhesive layer between the metal foil and the film. Background technique [0002] As disclosed in Japanese Patent Applications JP-A-59 232455, JP-A-61-275325, JP-A 62-212140 and JP-A 7-57540, flexible substrates are usually obtained by incorporating polyimide precursors The resin solution is directly coated on the conductor, then dried and cured. Japanese patent applications JP-A 2-180682, JP-A 2-180679, JP-A 1-245586 and JP-A 2-122697 also disclose that the polyimide precursor resin solution is applied to the conductor several times. on the method. [0003] For the method of coating the polyimide precursor resin solution on t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/088B05D7/14B05D7/24B32B5/00B32B7/12B32B15/08C08G69/26H05K1/00H05K1/03H05K3/38
CPCC09J179/08H05K3/386H05K1/0393H05K1/0346B32B15/08Y10T428/31681A61H39/04B43K23/08B43K29/00B32B7/12B32B15/02B32B15/18B32B15/20B32B27/281B32B2307/306B32B2307/3065B32B2435/00
Inventor 薄雅浩相泽道生藤原信星田繁宏天野正
Owner SHIN ETSU CHEM IND CO LTD
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