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Metal based board with copper foil coated compound medium

A metal matrix composite, copper clad laminate technology, applied in metal layered products, layered products, chemical instruments and methods, etc., can solve problems such as the inability to meet the needs of high-performance metal matrix composite materials

Inactive Publication Date: 2005-11-30
朱德明
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0002] At present, the insulation medium of metal-based copper-clad insulation boards in the market is composed of epoxy resin or anti-modification epoxy resin, which cannot meet the needs of high-frequency and microwave-based high-performance metal-based composite materials for the development of electronic communications.

Method used

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  • Metal based board with copper foil coated compound medium

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Effect test

Embodiment 1

[0009] Embodiment 1, as shown in the accompanying drawings, the preparation process is to mix raw materials such as tetrafluoroethylene with ceramics or rutile, or mix polytetrafluoroethylene, ceramics and rutile in proportion, dry several times, and sinter to form a composite material layer; proportioning copper, aluminum or iron in proportion, treating the copper, aluminum or iron-based surface, bonding composite material layer 2 and copper, aluminum or iron 1 with thermally conductive adhesive powder, composite material layer and copper foil 3 Perform one compression molding. The weight ratio of the three layers is controlled in the range of metal base:composite material:copper foil=4-7:2-5:0.1-2. The weight ratio of polytetrafluoroethylene to ceramics and rutile, single ceramics or single rutile is controlled in the range of 5-7:2-5.

Embodiment 2

[0010] Embodiment 2. The composite material layer 2 is glass cloth with polytetrafluoroethylene coating, and the polytetrafluoroethylene coating of the glass cloth is several to dozens of layers according to requirements. All the other preparation processes are the same as in Example 1.

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Abstract

The invention discloses metal-based composite medium foil plate to cover cupper. Cover composite material layer on metal plate and cupper foil on material layer; the composite material layer can be glass cloth with coating of politef, mixture of politef and ceramic or rutile, or mixture of politef, ceramic and rutile; it satisfies the require of high-performance metal composite material with high frequency and microwave to the development of electric communication.

Description

technical field [0001] The invention relates to a metal matrix composite dielectric copper clad board. Background technique [0002] At present, the insulating medium of metal-based copper-clad insulating boards on the market is composed of epoxy resin or anti-modified epoxy resin, which cannot meet the needs of high-frequency and microwave-based high-performance metal-based composite materials for the development of electronic communications. Contents of the invention [0003] In order to solve the above problems, the present invention provides a high-frequency, microwave-based high-performance metal-matrix composite dielectric copper-clad board. [0004] The invention relates to a metal-based composite dielectric copper-clad board. The metal plate is covered with a composite material layer, and the composite material layer is covered with copper foil; the composite material layer can be glass cloth with a polytetrafluoroethylene coating, or can be A mixture of PTFE and ...

Claims

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Application Information

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IPC IPC(8): B32B15/00
Inventor 朱德明
Owner 朱德明
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