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Welding disk for preventing host board short circuit

一种主机板、焊盘的技术，应用在印刷电路、印刷电路、印刷电路制造等方向，能够解决印刷电路板短路等问题，达到提升良率、避免短路现象的效果

Inactive Publication Date: 2005-12-28
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a welding pad that can solve the problem of short circuit of the printed circuit board caused by the bending of the pins of the plug-in components.

Method used

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  • Welding disk for preventing host board short circuit
  • Welding disk for preventing host board short circuit
  • Welding disk for preventing host board short circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0011] Please refer to Figure 5 to Figure 8 , the present invention is embodied in the improved design of the structure of the pad 20 of the printed circuit board (not shown in the figure), and the printed circuit board may be a single-layer board or a multi-layer board.

[0012] The jacks 10 and 11 are a pair of symmetrical circular opening areas on the printed circuit board, which are used for the leads of various larger components (not shown) containing two pins, such as resistors, capacitors, voltage regulators, etc. Pin sockets to provide electrical connections between these components and the printed circuit board. The pads 20 , 21 are located on the same side of the printed circuit board, and are solder areas around the circumference of the sockets 10 , 11 respectively. The discs 40 , 41 are circular areas tangent to the circular areas of the pads 20 , 21 . The material covered on the discs 40, 41 is the same as that of the pads 20, 21. This material is generally tin....

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PUM

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Abstract

The invention is used to avoid bending pins of component connect to neighboring circuit to cause short circuit when components are installed in printed circuit board by machine. At electrical wiring, a disk area being tangent with original bonding pad is added at peripheral area of original bonding pad in printed circuit board. With feature of bending pins of component generated by different assembly equipment, determines wiring position of disc and diameter of disc. The disc area and bonding pad area have same covering materials used in non-circuit area. When assembly equipment installs components in the printed circuit board, the part of bending pins out of bonding pad are dropped into disc area.

Description

【Technical field】 [0001] The invention relates to a structural design of a printed circuit board (PCB), in particular to a pad structure for avoiding a short circuit of a main board due to bending of part pins. 【Background technique】 [0002] Generally, many jacks are provided on the printed circuit board, and these jacks provide components, that is, plug-in components, to be plugged into the printed circuit board. When the printed circuit board is wired, a pad area is formed in a circular ring around each jack, and the covering material of these pads is usually tin, and the pad area is a non-trace area. After the plug-in components are plugged into the sockets of the printed circuit board, the wave / reflow soldering process is required to firmly fix these plug-in components on the printed circuit board. The pad area prevents the surrounding circuits from short circuiting during soldering. [0003] Usually, when manufacturing motherboards, larger plug-in components, such as...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R12/00H05K1/11H05K3/34
CPCH05K1/116H05K3/3447H05K2201/0949H05K2201/09781H05K2201/10651H05K2203/1446
Inventor 王萍李艳芳
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD