Supercharge Your Innovation With Domain-Expert AI Agents!

Method and system for reducing operational shock sensitivity of MEMS devices

By detecting and monitoring shock or vibration in MEMS devices, and adjusting closed-loop parameters and control signals, the pulse error problem of MEMS devices during mechanical impact is solved, the operating shock sensitivity is reduced, and it is suitable for fields such as optical communication systems.

Inactive Publication Date: 2006-01-18
JDS UNIPHASE CORP
View PDF3 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This compensation is not desired and can cause large additional errors due to improperly delayed feedback

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] Detailed description of the preferred embodiment

[0024] [21] see figure 1 , which shows a schematic diagram of a control system for a MEMS device in the prior art. The control system 100 includes a MEMS structure 110 , a detector 120 and a controller 130 . The controller 130 is electrically connected to the MEMS structure 110 and the detector 120 such that it forms part of the closed loop feedback circuit 140 . The MEMS structure 110 has mechanical elements 112 , electrical elements 114 and actuators 116 , all of which are formed on the same substrate 118 .

[0025] [22] In operation, the controller 130 provides control signals that drive the actuator 116 and thereby move the mechanical element 112 . As the mechanical element 112 moves, the detector 120 measures parameters related to the position of the mechanical element 112 and provides a feedback signal to the controller 130 . The controller 130 varies the control signal sent to the actuator 116 according to th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A method and system for reducing operational shock sensitivity of a MEMS device includes a closed-loop control circuit for controlling the MEMS device and a shock detector for detecting a shock experienced by the MEMS device. The closed-loop control circuit includes a movable MEMS structure, a detector for sensing a position of the MEMS structure and for providing a first feedback signal related to the sensed position, and a processor for receiving the first feedback signal and for providing a control signal used to control the MEMS device. The shock detector, which according to a preferred embodiment is the MEMS structure itself, is used for detecting the shock experienced by the MEMS device and for generating a second feedback signal, which is used to alter the control signal such that a response of the closed-loop control circuit to the shock is minimized.

Description

[0001] Cross-Referenced Related Applications [0002] [01] This application claims the benefit of US Provisional Patent Application No. 60 / 587,992, filed July 14, 2004, the contents of which are incorporated herein by reference. [0003] Microfilm Accessory [0004] [02] Not provided. technical field [0005] [03] The present application relates generally to microelectromechanical systems (MEMS), and in particular, the present application relates to methods and systems for reducing the operational shock sensitivity of MEMS devices. Background of the invention [0006] [04] Microelectromechanical systems (MEMS) use microfabrication techniques to integrate electrical and mechanical components on a single substrate, such as silicon. Typically, the electrical components are fabricated using integrated circuit methods and the mechanical components are fabricated using micromachining methods compatible with the integrated circuit methods. [0007] [05] The uses of MEMS devices ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B81B5/00G05D19/00
CPCG01P15/13G01P1/003
Owner JDS UNIPHASE CORP
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com