Manufacturing method of multifunction integrated sensor chip

A technology for integrating sensors and manufacturing methods, which is applied in the manufacture of semiconductor/solid-state devices, the manufacture of microstructure devices, and processes for producing decorative surface effects, etc. Small size, easy to package and easy to use
CN1725439AInactive Publication Date: 2006-01-25XI AN JIAOTONG UNIV
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
XI AN JIAOTONG UNIV
Publication Date
2006-01-25
Estimated Expiration
Not applicable · inactive patent

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Abstract

This invention discloses a preparing method for a multifunction integrated sensor chip, which applies micro-mechanical electronic technology and IC micro-processing technology to process three sensing units sensing pressure, temperature and humidity on an area of 5mmx5mm tube core, the pressure unit based on the piezo-resistance effect is used to test the pressure variance of environment, the temperature unit is used to test the change of environment temperature based on the thermal resistance effect and the humidity unit based on the capacitance theory used to test the variance of the environment humidity.
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Description

Technical field

[0001] The invention belongs to the field of micro-mechanical electronic system (MEMS) technology and integrated circuit micro-processing technology, and specifically relates to a method for manufacturing a multi-functional integrated sensor chip using micro-mechanical electronic system (MEMS) technology and integrated circuit micro-processing technology. Background technique

[0002] At present, various single-function sensor manufacturing technologies based on MEMS technology have become more and more mature, and sensor technology is developing in the direction of integration and intelligence. There are three ways to integrate sensors: one is to integrate multiple sensors with the same or similar functions into a one-dimensional or two-dimensional sensor array; the second is to integrate the sensor and integrated circuit on the same chip; the third is to integrate the sensor and the integrated circuit on the same chip; One refers to the i...

Claims

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