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Electroplating liquid and copper plating method using the electroplating liquid

A technology of electroplating solution and copper ions, which is applied in the direction of circuits, printed circuits, electrical components, etc., and can solve problems such as difficulties and difficulties in device planarization

Active Publication Date: 2011-09-14
ROHM & HAAS ELECTRONICS MATERIALS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This bump makes subsequent planarization of the device more difficult
Additionally, as electronic device geometries become smaller, it becomes more difficult to plate a uniform layer of copper while completely plating smaller features

Method used

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  • Electroplating liquid and copper plating method using the electroplating liquid
  • Electroplating liquid and copper plating method using the electroplating liquid
  • Electroplating liquid and copper plating method using the electroplating liquid

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-

[0059] Embodiment 1-comparative example

[0060] 40g / L copper (copper sulfate form), 10g / L sulfuric acid, 50ppm chloride ion, 10mL / L brightener, and 3mL / L inhibitor were mixed to prepare a copper electroplating solution. Brighteners are disulfide compounds with a molecular weight <1000 containing sulfonic acid groups. The inhibitor is an EO / PO copolymer with a molecular weight <5,000 containing terminal hydroxyl groups. The electroplating solution also contained 1 mL / L of a 1:1 reaction product of imidazole and epichlorohydrin as a single leveling agent. The polydispersity of this reaction product was <2.5 with a Mw of about 14,000.

[0061] A copper layer was electroplated onto the wafer substrate by contacting a rotating wafer (200 RPM) with the above plating solution at 25°C. Apply 60mA / cm 2 A copper layer was deposited on each wafer with a thickness of about 1 μm. The copper layer was analyzed by atomic force microscopy using conventional methods and found to have a...

Embodiment 2-

[0062] Embodiment 2-comparative example

[0063] The procedure of Example 1 was repeated except that the leveler used was a 1:0.6 reaction product of imidazole and 1,4-butanediol diglycidyl ether ("BDE"), which is a di Epoxy Functional Compounds:

[0064]

[0065] The reaction product has a polydispersity of <2.5 and a Mw of about 4,000. It exists in the amount of 6mL / L in the electroplating solution.

[0066] The Ra value of the copper layer deposited by the electroplating solution is 3.38nm and the Z value is 32.3nm as measured by an atomic force microscope. Figure 2A and 2B are scanning electron micrographs of the copper layer showing bumps on the 0.18 μm and 2 μm trenches, respectively. Figure 2A and 2B The uplift heights are 3830 and 4420 .

Embodiment 3

[0068] The procedure of Example 1 was repeated except that a mixture of two levelers was used. This leveling agent mixture comprises the 1: 1 imidazole and epichlorohydrin reaction product of 1mL / L (by electroplating solution) embodiment 1 and the 1: 0.6 imidazole and BDE of 6mL / L (by electroplating solution) embodiment 2 reaction product.

[0069] The copper layer deposited by this bath was found to have an Ra value of 4.82 nm and a Z value of 50.6 nm. Figure 3A and 3B are scanning electron micrographs of the copper layer showing very small bumps on the 0.18 μm and 2 μm trenches, respectively. Figure 3A and 3B The height of the bumps were and 860 .

[0070] The lower the Ra value, the smoother the surface. A low Z value indicates a more uniform surface height along the evaluated area. Therefore, copper layers with low Ra and Z values ​​are required. As can be seen from the above data, baths containing the leveler mixture of the present invention provide very smoot...

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Abstract

Plating baths containing a mixture of leveling agents, where the mixture includes a first level agent having a first diffusion coefficient and a second leveling agent having a second diffusion coefficient, are provided. Such plating baths deposit a metal layer, particularly a copper layer, that is substantially planar across a range of electrolyte concentrations. Methods of depositing metal layers using such plating baths are also disclosed. These baths and methods are useful for providing a planar layer of copper on a substrate having small apertures, such as an electronic device.

Description

technical field [0001] The present invention relates generally to the field of electroplating compositions. In particular, the invention relates to the field of copper electroplating compositions. Background technique [0002] A method of electroplating an article with a metallic paint generally involves passing an electric current between two electrodes of an electroplating bath, one of which is the article to be electroplated. Typical acidic copper plating baths include dissolved copper (usually copper sulfate), an acidic electrolyte (such as sulfuric acid) in an amount sufficient to make the bath conductive, and special additives to improve plating uniformity and metal deposition quality. Such additives include brighteners, levelers, surfactants, inhibitors and the like. [0003] Electrolytic copper plating baths have many industrial applications. They are used, for example, as base layers in the automotive industry for the subsequent deposition of decorative and anti-...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/38
CPCC08G59/184C25D3/38H05K3/423H01L21/2885
Inventor D·王R·D·米克拉C·吴G·G·巴克利
Owner ROHM & HAAS ELECTRONICS MATERIALS LLC