Electricity conductive liquid capable of directly galvanizing the printed board

A technology of conductive liquid and printed board, which is applied in the direction of electrical connection formation of printed components, can solve the problems of long chemical copper plating process, carcinogenicity, and difficult biodegradation, so as to ensure the quality of interlayer interconnection, reduce production costs, The effect of reducing material consumption

Inactive Publication Date: 2006-02-15
吕桂生 +1
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  • Application Information

AI Technical Summary

Problems solved by technology

Although this technology has been used for many years and has been continuously improved, it still has the following shortcomings that are difficult to overcome: 1. Using formaldehyde (Formal dehyde) as a reducing agent not only endangers the ecological environment, but also has the risk of carcinogenesis
2. EDTA, the complexing agent of electroless copper plating, is not easy to biodegrade, and the wastewater treatment is very difficult
3. The stability of the electroless copper plating solution is poor, and the solution will decompose if the operation is a little careless. The requirements for monitoring and maintenance are very strict
5. The electroless copper plating process is long, operation and maintenance are extremely inconvenient, quality control is difficult and operating costs are high

Method used

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Embodiment Construction

[0008] 3.5% graphite, 0.5% Na 2 SiO 3 , 1% anionic surfactant, 2% NH 4 OH and 93% water are neutralized and stirred, and finally the electroplating solution is synthesized, namely the black hole solution.

[0009] In the application of black hole liquid, two methods can be used: immersion type and horizontal type.

[0010] 1. Immersion type: it is more suitable for small enterprises, because this method does not need to purchase additional equipment, and the manufacturer uses the two-step method of impregnation→drying under the existing conditions. 2. Horizontal type: It must be implemented with special equipment, which is more suitable for medium and large enterprises. It can realize the whole process of black hole in one step in a short period of time, and can greatly increase the production capacity.

[0011] PCB manufacturers can decide whether to choose the dipping type or the horizontal type according to the conditions of the enterprise.

[0012] The following is the...

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Abstract

The conductive liquid to plate directly the printed board comprises graphite 2-5%, Na2SiO3 0.5-1%, anionic surface active agent 0.5-2%, NH4OH 2-4% and water 88-96%. The product has advantages: 1. well stability. There is no hydrogen separated out during absorption to copper covered plate to ensure layer interlinkage quality; there is no chemical reaction to consume other constituents; thereby, it needs not to analyze and adjust solution to add fresh liquid for real production; 2. it is convenient to operate and maintenance and reliable; 3. it saves labor and time, controls effectively the waste water discharge, and decreases consumption and cost.

Description

[0001] Field: [0002] The invention belongs to a metal conductive liquid, in particular to a conductive liquid capable of directly electroplating printed boards. Background technique: [0003] Hole metallization is the most critical process link in the printed circuit board (PCB) manufacturing process. For a long time, the electroless copper deposition technology has been the mainstream technology to realize hole metallization, which is an autocatalytic redox reaction. Although this technology has been used for many years and has been continuously improved, it still has the following shortcomings that are difficult to overcome: 1. Using formaldehyde (Formal dehyde) as a reducing agent not only endangers the ecological environment, but also has the risk of carcinogenesis. 2. EDTA, the complexing agent of electroless copper plating, is not easy to biodegrade, and the wastewater treatment is very difficult. 3. The stability of the electroless copper plating solution is poor, a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/56H05K3/42
Inventor 吕桂生李步杰
Owner 吕桂生
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