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Backing plates for sputtering targets

A technology of backing plate and sputtering target, which is applied in the field of backing plate for sputtering target, which can solve the problems of increased cost, failure to prevent cracking of brazing material, insufficient combination of target and backing plate, etc., to reduce cracking , save the effect of leveling treatment

Inactive Publication Date: 2006-04-26
KOBELCO RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

According to this technique, the combination of target and backing plate does not sufficiently and reliably reduce the difference in coefficient of thermal expansion, and does not prevent cracking of the brazing filler metal
Additionally, the cost increases if the backing plate is manufactured from the same material as the typical Al-Nd alloy target

Method used

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  • Backing plates for sputtering targets
  • Backing plates for sputtering targets
  • Backing plates for sputtering targets

Examples

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Embodiment Construction

[0021] The inventors of the present invention conducted exhaustive studies on a backing plate for sputtering targets that reduces warpage occurring when bonding to the target and film deposition (sputtering) of Al-Nd alloy thin films. Stress, eliminating the leveling of warpage, reducing the cracking of the brazing solder placed between the target and the backing plate caused by repeated warpage formation and leveling, and thus enabling stable film deposition operations over a long period of time . In particular, they conducted exhaustive studies on backing plates for sputtering targets that reduce warpage, thereby allowing even targets containing Al alloys characterized by relatively low linear expansion coefficients such as Al- In the case of Nd, Al-Ti and Al-Ta alloys, or metals such as Mo, Ta and Ti, leveling is also omitted and film deposition can be repeated.

[0022] Therefore, they found that the optimal backing plate for sputtering targets contained an average linear...

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Abstract

A backing plate for a sputtering target includes an aluminum alloy having an average linear expansion coefficient of 23.0×10-6 / °C or less at a temperature of 25°C to 100°C. This kind of backing plate prevents the warpage that occurs when it is combined with the target, reduces the stress that occurs during the film deposition (sputtering) of the Al-Nd alloy film, saves the warpage leveling treatment, and reduces the installation time. Fracture of the brazing material between the target and the backing plate enables a stable film deposition operation over a long period of time.

Description

technical field [0001] The present invention relates to a backing plate for a sputtering target. Specifically, it relates to a backing plate for a sputtering target, which prevents warpage during bonding with the target and / or film deposition (sputtering) of an Al-Nd alloy thin film, and enables long-term stable film deposition operations. Background technique [0002] Sputtering is commonly used to make the thin films that make up liquid crystal panels and organic electroluminescent (EL) panels used in televisions, laptops, and other monitors , and to fabricate interconnect films for optical recording and semiconductor fields. In the sputtering method, a plasma discharge is induced between a substrate and a target serving as a film material, the gas ionized by the plasma discharge collides with the target, thereby knocking atoms out of the target, and these atoms are deposited on the substrate to produce thin films. Compared with vacuum vapor deposition and arc ion plat...

Claims

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Application Information

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IPC IPC(8): C23C14/34
CPCC23C14/3407H01J37/3435C22C21/02C23C14/14
Inventor 茂山和基森元荣一
Owner KOBELCO RES INST
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