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Solder paste and printed board

A solder paste and alloy powder technology, applied in printed circuits, printed circuits, printed circuit manufacturing, etc., can solve the problems of tiny solder balls in the soldered part, peeling of the soldered part, and unresolved corrosion resistance, so as to improve the resistance to Corrosive, anti-corrosion effect

Inactive Publication Date: 2006-04-26
SENJU METAL IND CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0017] However, the existing solder paste using Sn-Zn based lead-free solder mixture powder has a problem of producing tiny solder balls on the soldered part during reflow.
In addition, these solder pastes have not yet solved the problem of corrosion resistance because the soldering parts made of copper are peeled off due to corrosion over a long period of time.

Method used

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  • Solder paste and printed board
  • Solder paste and printed board

Examples

Experimental program
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Effect test

Embodiment

[0054] Sn-Zn alloy powders and Sn-Ag alloy powders having the compositions shown in Tables 1 and 2 were respectively prepared by a gas atomization method. The average particle diameter of these alloy powders is in the range of 10-50μm. These alloy powders are mixed at the mixing ratios shown in Tables 1 and 2 and mixed with a polymerized rosin flux containing diphenylguanidine HBr as an active agent and hardened castor oil as a thixotropic agent (solvent is α-terpene Pinol) is mixed and formulated into solder paste. Tables 1 and 2 show the composition of the mixed powder.

[0055] For these solder pastes, the following performance investigations were conducted.

[0056] [Corrosion resistance]

[0057] Test piece: In the molten solder alloy formed by heating the mixed powder for solder paste to 250°C, a pitch of 0.3mm×10mm×15mm was immersed at a depth of 15mm to prepare a soldering test piece.

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Abstract

The invention provides a solder paste. In the solder paste formed by mixing alloy powder and flux, the alloy powder is a mixed powder of at least one Sn-Zn alloy powder and at least one Sn-Ag alloy powder. Each alloy may further contain one or two or more of Bi, In, Cu, and Sb. Zn: 5-10% by mass, Ag: 0.005-1.5% by mass, Cu: 0.002-1.0% by mass, Bi: 0.005-15% by mass, In: 0.005-15% by mass, Sb: 0.005 to 1.0% by mass of one or more alloy powders are blended so that the remainder is composed of Sn.

Description

Technical field [0001] The invention relates to a solder paste used in soldering of electronic instruments, in particular to a solder paste that does not contain Pb in solder powder, and a printed circuit board soldered with the solder paste. Background technique [0002] The reflow soldering method (hereinafter referred to as the reflow method) is particularly suitable for soldering electronic components. The reflow method is a kind of solder paste made of solder powder and flux, which is applied to the necessary position of the printed circuit board (typically on the copper pad) by the printing method or the spraying method, where it is applied After the electronic components are installed, they are heated to a temperature at which the solder powder in the solder paste is melted by a heating device called a reflow furnace, and then the electronic components are soldered to the printed circuit board. [0003] The reflow method can be used to solder multiple locations in a single...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/22B23K35/02B23K35/14B23K35/26H05K3/34
CPCB23K35/0244B23K35/262H05K3/3463H05K2201/0272H05K3/3485B23K35/22B23K35/26
Inventor 平田昌彦田口稔孙奥山雅宣丰田良孝
Owner SENJU METAL IND CO LTD
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