Laminated mould of multi-layer circuit board

Abstract

The invention is made by means of following steps: takes high grade mirror surface stainless steel as material of lower mold plate and upper mold plate; the counter bore perpendicular to axial line of location hole is located at the bottom surface of location hole in the lower mold plate; the step locating pin is composed of the locating column and the foundation; the locating column is perpendicular to the foundation, and the upper mold plate and the lower mold plate are jointed through the step locating pin. Because the location holes in the lower mold plate and the up mold plate coincides with designing basis for each layer of circuit in multi layer circuit board, and is processed by using digital control equipment, the laminating mold has not only precise location, but also low weight, and can process 8 piece multi layer circuit board at on time by hot-pressed.

Description

Technical field: [0001] The invention relates to a lamination mold of a multilayer circuit board. Background technique: [0002] Multi-layer circuit boards are different from double-sided circuit boards. In multi-layer circuit boards, multi-layer circuit patterns are set, and the circuit patterns of each layer must be connected through predetermined connection holes. The manufacturing process is as follows: [0003] CAD and light painting→inner layer cutting→drilling positioning holes→scrubbing→coating photoresist→exposure→developing→etching→removing film→inner layer inspection→cleaning→inner layer blackening→lamination→NC drilling→ Hole inspection→hole pretreatment→copper sinking→copper layer inspection→graphic making→graphic plating→film removal→etching→lead and tin stripping→making solder mask graphics→curing→hot air leveling→printing character graphics→milling shape→cleaning and drying →Electrical testing→Baking plate→Finished product inspection→Packing and leaving the ...

AI Technical Summary

Problems solved by technology

The disadvantages of this laminated mold are:

[0005] 1. The production cost of the positioning system of the entire multilayer circuit board is relatively high. During the lamination process of each multilayer circuit board, the release film 8 and the aluminum plate 7 must be used, and the release film 8 and the aluminum plate 7 can only be used once Permanent use, can not be reused, not only the process is complicated, but also the cost is high

[0006] 2. The upper template 1 and the lower template 2 of the mold are too thick, the mold is heavy, not only the heat transfer speed is slow, but also the heat transfer is uneven, which affects

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