Curable organopolysiloxane resin composition for optical transmission components, optical transmission components, and fabrication process thereof

A technology of polysiloxane resin and light-transmitting components, which is applied in the field of light-transmitting components and curable organopolysiloxane resin compositions, and can solve problems such as increasing material costs

Inactive Publication Date: 2006-06-07
DOW CORNING CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, Japanese Patent Application Laid-Open No. 2000-230052 provides an organopolysilsesquioxane having a fluorinated hydrocarbon gro

Method used

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  • Curable organopolysiloxane resin composition for optical transmission components, optical transmission components, and fabrication process thereof
  • Curable organopolysiloxane resin composition for optical transmission components, optical transmission components, and fabrication process thereof
  • Curable organopolysiloxane resin composition for optical transmission components, optical transmission components, and fabrication process thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0141] This example illustrates the formation of a cured product of a methylvinylphenyl polysiloxane resin used in a light transmissive assembly. The above-mentioned methylvinylphenylpolysiloxane resins (A-1), (A-2) and (A-3) (which were used as the group component (A)), the above-mentioned methylphenylhydrogenated polysiloxanes (B-1) and (B-2) (they are used as component (B)), platinum / 1,3-divinyltetramethyl Disiloxane complex [platinum content: 2% by weight] (C) (it is used as component (C)), methyl(tris(1,1-dimethyl-2-propynyloxy))silane ( E) (which is used as a curing retarder) and toluene (which is used as component (d1)) were mixed to prepare a coating solution containing a curable organopolysiloxane resin composition for light-transmitting components.

[0142] Using an open chamber system, the coating solution was spin-coated on a silicon substrate at 2000 rpm and allowed to stand at room temperature for 10 minutes. Thereafter, a hydrosilylation-cured product of methy...

Embodiment 2

[0148] This example illustrates the formation of a groove-type optical waveguide composed of a cured product of methylvinylphenyl polysiloxane resin produced by a coating method.

[0149] Composition 5 in Table 1 was spin-coated on a silicon substrate at 2000 rpm using an open chamber system and allowed to stand at room temperature for 10 minutes. Thereafter, a film composed of a hydrosilylation cured product of methylphenylhydrogenopolysiloxane and methylvinylphenylpolysiloxane resin having a uniform thickness of 7 μm was obtained by heating at 180° C. for 90 minutes. Its refractive index is 1.519. Next, a film composed of this cured product was used as a bottom cladding, on which Composition 3 of Table 1 was spin-coated at 2000 rpm and left at room temperature for 10 minutes. Thereafter, a film composed of a hydrosilylation cured product of methylphenylhydrogenopolysiloxane and methylvinylphenylpolysiloxane resin was formed having a uniform thickness of 7 μm by heating at 1...

Embodiment 3

[0152] This example illustrates the formation of a strip-shaped optical waveguide composed of a cured product of methylvinylphenyl polysiloxane resin produced by a coating method. After coating composition 5 of Table 1 on a glass substrate and standing at room temperature for about 30 minutes, the composition was cured by heating at 100° C. for 1 hour and at 180° C. for 1 hour, and then at room temperature from A glass substrate was peeled off to produce a film having a thickness of 50 μm composed of a hydrosilylation cured product of methylphenylhydropolysiloxane and methylvinylphenylpolysiloxane resin. Its refractive index is 1.519. Films composed of this cured product show no polarization dependence, demonstrating that its birefringence is so small that it can be ignored.

[0153] A film composed of the cured product was used for the bottom cladding, and Composition 3 of Table 1 was coated thereon, and heat-cured in the same manner, thereby forming a core layer having a re...

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Abstract

The present invention relates to a hydrosilylation-curable organopolysiloxane resin composition for a light-transmitting component, especially a light-transmitting component used as an optical communication element, which comprises (A) an aliphatic compound having three or more monovalent unsaturated Hydrocarbyl and aromatic hydrocarbon-based organopolysiloxane resins, (B) an organosilicon compound having two or more silicon-bonded hydrogen atoms and aromatic hydrocarbon groups, (C) a hydrosilylation catalyst, and optionally ( D) (d1) solvent or (d2) hydrosilylation-reactive organosiloxane type diluent relating to a light-transmitting component represented by an optical waveguide comprising a hydrosilylation cured product of the above-mentioned organopolysiloxane resin and organosilicon compound , and also relates to a method of manufacturing a light-transmitting component.

Description

technical field [0001] The present invention relates to a curable organopolysiloxane resin composition for light-transmitting components, especially for light-transmitting components used as optical communication elements, and relates to light-transmitting components represented by optical waveguides, including organopolysiloxane The hydrosilylation cured product of the resin also relates to a method for manufacturing a light-transmitting component. Background technique [0002] Quartz and glass are used not only as optical fiber materials but also as materials for optical communication elements because they are high-reliability materials. However, such inorganic materials require high-temperature processing and have poor productivity characteristics, leading to a demand for organic materials for optical communication elements with sufficient processability and durability. The most reliable material is polyimide, which is widely used as a material for electronic components....

Claims

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Application Information

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IPC IPC(8): C08L83/04
Inventor 栉引信男小川琢哉竹内贵久子
Owner DOW CORNING CORP
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