Copper alloy having bendability and stress relaxation property

Abstract

The copper alloy contains 0.01 to 1.0% by mass of Fe, 0.01 to 0.4% by mass of P, and 0.1 to 1.0% by mass of Mg, the balance being copper and unavoidable impurities, and the volume fraction of the dispersoid whose particle diameter exceeds 200nm is 5% or more, wherein the particle diameter is 200nm or less and the average particle diameter of the dispersion containing Mg and P is 5nm or more and 50nm or less. It is preferable that the average particle diameter of the dispersoid containing Fe and P of the copper alloy is 20 nm or less. The copper alloy has improved bendability and stress relaxation properties.

Description

technical field [0001] This invention relates to copper alloys having bendability and stress relaxation properties. Specifically, it relates to raw materials for copper alloy sheets suitable for use in semiconductor elements such as IC lead frames for semiconductor devices; materials for electric / electronic elements such as printed wiring boards; switching elements; and mechanical elements such as bus bars, terminal equipment and connectors. Background technique [0002] Cu—Fe—P alloys have been commonly used as copper alloys for upper applications such as IC lead frames for semiconductor devices. Examples of these Cu-Fe-P alloys include: a copper alloy containing 0.05% to 0.15% Fe and 0.025% to 0.040% P (C19210 alloy) and a copper alloy containing 2.1% to 2.6% Fe, 0.015% to 0.15% Copper alloy of P and 0.05% to 0.20% Zn (CDA194 alloy). Among these copper alloys, these Cu-Fe-P alloys show high strength, high electrical conductivity, and high thermal conductivity when dispe...

AI Technical Summary

Problems solved by technology

These techniques cannot make the alloy simultaneously bendable