Screen printing machine and printing method thereof

Abstract

A printing mechanism (6) of a screen printer (1) for printing a paste (P) through a screen (S) onto a workpiece (W) at a printing position comprising: contacting the screen at a distal end A filling nozzle (62), a filling head (62) into which paste consumed during printing is filled, and a feed box (63) for supplying paste into the filling head. There is an extrusion mechanism (62b, 63a) in each of the filling head and the feed box, and the extrusion pressure of the paste to the screen mask can be controlled. The printing mechanism also includes a filling head support mechanism (64), which can support the filling head in such a way that the filling head can move up and down, and can also adjust the thrust of the filling head on the screen.

Description

technical field [0001] The present invention relates to a screen printing machine and printing method for printing solder paste or the like on a substrate through a screen mask. More particularly, the present invention relates to screen printing machines and printing methods suitable for applying screen printing to high-density multilayer substrates. Background technique [0002] In order to connect a printed substrate and a semiconductor chip, a connection system called a "flip-chip FC bonding system" using solder bumps (tiny solder bumps) is generally used. By arranging semiconductor bumps on a plane, this system can connect thousands of connection points at a time. With the development of information technology, semiconductor chips have higher functions and the connection situation of such semiconductor chips requires smaller size, higher density and larger number of connection points. [0003] In order to form solder bumps, Japanese Unexamined Patent Publication No. 11...

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