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Hole type yam cultivation method

A yam and hole-type technology, which is applied in the field of yam cultivation, can solve the problems of small field production, labor and time-consuming for harvesting, etc., and achieve the effects of increasing commodity value, saving investment in cultivation, and avoiding damage.

Inactive Publication Date: 2006-07-12
SICHUAN UNIV
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AI Technical Summary

Problems solved by technology

[0002] Because the root of yam can reach 1m deep into the ground, and the root of yam is crisp and tender, it is very labor-intensive and time-consuming to harvest.
For this reason, the application number that the applicant applied for on December 24th, 2003 is 2003101041049 " yam is easy to turn over glass fiber reinforced plastic groove cultivation method ", and this application has solved the gathering difficult problem of Chinese yam, but must invest fiberglass groove, is not quite suitable simultaneously. Produced in Daejeon, the application number of 2005100209357 was applied on May 23, 2005 for the "Yam Gap Filling Cultivation Method". This application saves the investment of glass fiber reinforced plastic grooves and is suitable for Daejeon production, but it still needs to invest in ditching before planting. More man-hours, as well as the investment of polystyrene foam beads and films

Method used

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Embodiment Construction

[0017] In the field where yam is to be planted, first plan the 15-18cm thick soil layer on the ground according to the row, and then use a special field soil puncher to drill vertically downward according to the predetermined plant spacing. The hole diameter is 10cm, and the hole depth is 1.3m. After the hole tool, insert a thin polypropylene tube with a thickness of 1mm into the orifice. The outer diameter of the thin tube is consistent with the diameter of the ground hole, and the length is 30cm. The lower part of the tube is straight, and there is a transverse annular fin along the upper mouth. The outer diameter of the wing is 15cm, and the thickness is 1mm. A piece of polyethylene film with a thickness of 0.02mm and a diameter of 25cm is placed on the upper mouth of the thin tube, and the film is folded back along the periphery of the upper mouth of the thin tube and pressed on the Between the fin and the soil, use a blade to draw a 3cm opening in the center of the film, t...

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Abstract

The root of Chinese yam under ground is 1m in length, and is very tender, which makes the digging and picking be time and labor consuming and damage the Chinese yam, the invention provides a hole cultivating method for Chinese yam, drilling vertically in the field with special punch, sowing the Chinese yam seed on the aperture mulch film after mulch film enclosing to make Chinese yam grow in suspended state after crossing the mulch film, which not only improves the Chinese yam quality greatly, but also make the Chinese yam picking and recovery more easier, and at the same time avoids the damage caused by digging.

Description

1. Technical field [0001] The invention relates to a yam cultivation technique, in particular to a technique of vertically opening holes in a field and then planting yams on the holes. 2. Background technology [0002] Because the root of yam can reach 1m deep into the ground, and the root of yam is crisp and tender, it is very labor-intensive and time-consuming to harvest. For this reason, the application number that the applicant applied for on December 24th, 2003 is 2003101041049 " yam is easy to turn over glass fiber reinforced plastic groove cultivation method ", and this application has solved the gathering difficult problem of Chinese yam, but must invest fiberglass groove, is not quite suitable simultaneously. Produced in Daejeon, the application number of 2005100209357 was applied on May 23, 2005 for the "Yam Gap Filling Cultivation Method". This application saves the investment of glass fiber reinforced plastic grooves and is suitable for Daejeon production, but it...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A01G1/00A01G7/00A01C14/00
Inventor 梁德富
Owner SICHUAN UNIV
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