Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Collet, chip bonder and chip pick-up method

A collet and chip technology, applied in chucks, electrical components, manipulators, etc., can solve the problems of cracking and easy occurrence of chip chips, and achieve the effect of preventing splitting

Inactive Publication Date: 2006-07-12
CANON MACHINERY
View PDF0 Cites 19 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the deformation recovery force of the chip is less than 50 mg, it is particularly likely to occur, and depending on the situation, the thin chip chip may crack

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Collet, chip bonder and chip pick-up method
  • Collet, chip bonder and chip pick-up method
  • Collet, chip bonder and chip pick-up method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0094] About the tool 10 of the first embodiment of the present invention such as Figure 1A~Figure 1C As shown, there is a collet holder 20 and a collet 30 mounted on the collet holder 20. The collet holder 20 is made of, for example, stainless steel, and has a vacuum suction hole 21 connected to a vacuum system at its center, and has two mounting screw holes 22 for mounting the collet holder 20 on a supporting member, 23. A descending portion 24 in the peripheral portion of the lower peripheral portion, and a recess 25 surrounded by the descending portion 24.

[0095] The collet 30 is made of stainless steel, nitrile rubber, fluorine rubber, heat-resistant resin, etc. depending on the application. It has a flat surface 31 on the bottom and a large number of penetrating through (Figure Examples are rectangular sheet chips, 3 vertical x 5 horizontal 15) small diameter vacuum suction holes 32, convex portions 33 embedded in the recesses 25 of the collet holder 20, and the collet ho...

Embodiment 2

[0104] Hereinafter, referring to the collet 10A of the second embodiment of the present invention, refer to Figure 3A , Figure 3B , Figure 3C Be explained. The collet 10A includes a collet holder 20 and a collet 30A. Collet holder 20 with Figure 1A The collet holders 20 shown are the same, so the same reference numerals are given to the same parts, and the description thereof is omitted.

[0105] The collet 30A has a flat surface 31 below, a plurality of small diameter vacuum suction holes 32, a convex portion 33 embedded in the recess 25 of the collet holder 20, and abuts against the lower surface of the descending portion 24 of the collet holder 20 Of the flange portion 34, and Figure 1A The collet 30 is the same, but the difference is that it also has a plurality of grooves 35 communicating with the lower end of the vacuum suction hole 32 in one direction, and a plurality of grooves communicating with the lower end of the vacuum suction hole 32 in the other direction.部36. ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A bonding tool (10) is constituted of a collet holder (20) and a collet (30). The collet holder (20) comprises a vacuum suction hole (21) at the center, attaching threaded holes (22, 23) for attaching the collet holder (20) to a support member, a depending section (24) at the bottom, and a recess (25) in the depending section (24). The collet (30) comprises a flat surface (31) at the lower end, a plurality of vertically extending vacuum suction through-holes (32), a projection (33) adapted to fit in the recess (25), and a flange (34) abutted against the lower surface of the depending section (24). A space (26) is defined such that the depth dimension H1 of the recess (25) and the height dimension H2 of the projection (33) are set H1 > H2, and communication is established between the vacuum suction holes (21, 32) through the space (26). The plurality of vacuum suction holes (32) vacuum-suck the periphery of a chip, whereby pick-up and bonding are effected.

Description

Technical field [0001] The present invention relates to a collet, a die bonder using the collet, and a method for picking up chips of the die bond device. For example, it relates to a method for picking up a thin semiconductor chip (chip) from a wafer. (die)), and use soldering flux, brazing flux, silver paste, resin and other bonding materials on a substrate such as a lead frame to solder collets, die attaching devices, and particularly suitable for picking up thin semiconductor chips . Background technique [0002] Semiconductor elements are generally manufactured by soldering (bonding) substrates such as printed wiring boards and lead frames on the back surface of semiconductor chips (small chips) using bonding materials such as soldering flux, brazing flux, silver paste, and resin. [0003] In this chip attaching device that solders semiconductor chips on a substrate, such as Figure 4 As shown, a pick-up and bonding tool (hereinafter referred to as a tool) 40 that moves betw...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/52B25J15/06H01L21/60H01L21/68H01L21/00H01L21/683
CPCH01L21/6838H01L2924/01082H01L2924/01047H01L21/67132H01L2224/75743H01L2924/01005H01L2924/01033H01L21/67144H01L2924/01006H01L2224/83192H01L2221/68322H01L2924/01012H01L24/75
Inventor 永元信裕
Owner CANON MACHINERY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com