Collet, chip bonder and chip pick-up method

A collet and chip technology, applied in chucks, electrical components, manipulators, etc., can solve the problems of cracking and easy occurrence of chip chips, and achieve the effect of preventing splitting
CN1802735AInactive Publication Date: 2006-07-12CANON MACHINERY
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
CANON MACHINERY
Publication Date
2006-07-12
Estimated Expiration
Not applicable · inactive patent

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Abstract

A bonding tool (10) is constituted of a collet holder (20) and a collet (30). The collet holder (20) comprises a vacuum suction hole (21) at the center, attaching threaded holes (22, 23) for attaching the collet holder (20) to a support member, a depending section (24) at the bottom, and a recess (25) in the depending section (24). The collet (30) comprises a flat surface (31) at the lower end, a plurality of vertically extending vacuum suction through-holes (32), a projection (33) adapted to fit in the recess (25), and a flange (34) abutted against the lower surface of the depending section (24). A space (26) is defined such that the depth dimension H1 of the recess (25) and the height dimension H2 of the projection (33) are set H1 > H2, and communication is established between the vacuum suction holes (21, 32) through the space (26). The plurality of vacuum suction holes (32) vacuum-suck the periphery of a chip, whereby pick-up and bonding are effected.
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Description

Technical field

[0001] The present invention relates to a collet, a die bonder using the collet, and a method for picking up chips of the die bond device. For example, it relates to a method for picking up a thin semiconductor chip (chip) from a wafer. (die)), and use soldering flux, brazing flux, silver paste, resin and other bonding materials on a substrate such as a lead frame to solder collets, die attaching devices, and particularly suitable for picking up thin semiconductor chips . Background technique

[0002] Semiconductor elements are generally manufactured by soldering (bonding) substrates such as printed wiring boards and lead frames on the back surface of semiconductor chips (small chips) using bonding materials such as soldering flux, brazing flux, silver paste, and resin.

[0003] In this chip attaching device that solders semiconductor chips on a substrate, such as Figure 4 As shown, a pick-up and bonding tool (hereinafter referred to as a tool) 40 that moves betw...

Claims

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