Apparatus including 4-way valve for fabricating semiconductor device, method of controlling valve, and method of fabricating semiconductor device using the apparatus

A technology for semiconductors and devices, applied in the field of devices for manufacturing semiconductor devices, can solve the problems of slow diffusion and release of source gas materials, difficulty in ALD, and inability to completely remove them, and achieve the effect of improving purging efficiency
CN1825537AActive Publication Date: 2006-08-30SAMSUNG ELECTRONICS CO LTD +1
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Patent Information

Authority / Receiving Office
CN ยท China
Patent Type
Applications(China)
Current Assignee / Owner
SAMSUNG ELECTRONICS CO LTD
Publication Date
2006-08-30

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Abstract

An apparatus and method for fabricating a semiconductor device using a 4-way valve with improved purge efficiency by improving a gas valve system by preventing dead volume from occurring are provided. The apparatus includes a reaction chamber in which a substrate is processed to fabricate a semiconductor device; a first processing gas supply pipe supplying a first processing gas into the reaction chamber; a 4-way valve having a first inlet, a second inlet, a first outlet, and a second outlet and installed at the first processing gas supply pipe such that the first inlet and the first outlet are connected to the first processing gas supply pipe; a second processing gas supply pipe connected to the second inlet of the 4-way valve to supply a second processing gas; a bypass connected to the second outlet of the 4-way valve; and a gate valve installed at the bypass.
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Description

technical field

[0001] The present invention relates to an apparatus for manufacturing semiconductor devices, and more particularly, to an apparatus for employing a 4-way valve by improving the valve system for supplying gas to a reaction chamber with improved purge (purge) An apparatus for efficiently manufacturing a semiconductor device, a method for controlling the 4-way valve, and a method for manufacturing a semiconductor device using the apparatus. Background technique

[0002] Semiconductor devices are manufactured by repeatedly performing processes such as deposition and patterning of thin layers on the surface of a substrate, that is, a wafer. Deposition and patterning of the thin layers is typically done in a semiconductor processing module. The configuration of a semiconductor processing module varies depending on the process used in the process of manufacturing semiconductor devices, but it basically includes a reaction chamber defining a reaction area in which ...

Claims

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