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Microelectrode short-circuit-proof squeegee structure

A technology of microelectrode and isolation glue, which is applied in the structural field of microelectronics technology, can solve problems such as circuit short circuit, achieve the effects of preventing short circuit of conductive particles, improving connection reliability, and simple production process

Inactive Publication Date: 2006-09-06
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this connection structure is difficult to prevent the bridging of conductive particles in the crimping layer between adjacent electrodes, and it also has a certain probability of circuit short circuit.

Method used

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  • Microelectrode short-circuit-proof squeegee structure

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Embodiment Construction

[0010] Such as figure 1 As shown, the present invention includes: a base portion 3 embedded in the gap of the microelectrode 2 of the chip 1 and a protruding portion 4 higher than the microelectrode 2. The base part 3 completely fills the gap of the microelectrode 2, the length is the length of the microelectrode 2, the width is the gap distance of the microelectrode 2, and the height is the height of the microelectrode 2. The length of the protruding part 4 is also the length of the microelectrode 2, the width is the gap distance of the microelectrode 2, and the height is about 4um-8um higher than the microelectrode 2.

[0011] The shape of the protruding part 4 is a needle-pointed shape, an inverted trapezoid shape, a rectangle, or a triangle, wherein the preferred shape is a needle-pointed shape, and the side wings of the needle-pointed protruding portion 4 are arc-shaped.

[0012] When applying the preferred insulating glue structure of the present invention for hot-press pack...

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Abstract

The present invention relates to a microelectrode short circuit proof squilgee structure, belonging to microelectronic technique field. Said invention includes base embed in microelectrode interval and bulge above microelectrode, wherein base part completely filling microelectrode interval and having same length, width and height with that of microelectrode, said bulge having height higher 4-8 micrometer than that of microelectrode, the optimized shape being pinpoint shape its flank being arcs of circles shape. Said invented squilgee not only can effectively prevent short circuit due to adjacent microelectrode interspaceal conducting particles bridging, but also prevent short circuit due to conducting particles bridging between adjacent microelectrode pressure welding layers.

Description

Technical field [0001] The invention relates to a structure in the technical field of microelectronics, and in particular to a structure of a microelectrode short-circuit-proof isolation glue. Background technique [0002] In the field of semiconductor packaging or liquid crystal display (LCD), anisotropic conductive adhesives are directly used to mount semiconductor chips on a substrate, for example, to connect the chip to an LCD (or FPC). Through the hot pressing process, the chip is directly flip-mounted on the substrate with anisotropic conductive glue. A plurality of conductive particles deformed under pressure are sandwiched between the microelectrodes of the chip and the pads of the corresponding substrate, and the upper and lower microelectrodes are electrically connected by these deformed conductive particles. At the same time, the chip and the substrate are cured by the epoxy resin base material of anisotropic conductive adhesive to realize the mechanical support and he...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/482
Inventor 丁汉谢斌吴懿平
Owner SHANGHAI JIAO TONG UNIV
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