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Thermal protection for a VLSI through reduced C4 usage

An integrated circuit and voltage technology, applied in the direction of using electromagnetic means, using directly heat-sensitive electric/magnetic elements, thermometers, and electric devices, can solve problems such as electromagnetic radiation

Inactive Publication Date: 2006-10-04
SONY COMPUTER ENTERTAINMENT INC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Also, sending the signal from the thermal diode, through the chip, and then through the C4 I / O would result in unnecessary length of the bus on the chip, which would also cause EMI issues, etc.

Method used

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  • Thermal protection for a VLSI through reduced C4 usage
  • Thermal protection for a VLSI through reduced C4 usage
  • Thermal protection for a VLSI through reduced C4 usage

Examples

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Embodiment Construction

[0013] In the following discussion, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be understood by those skilled in the art that the present invention may be practiced without such specific details. In other instances, well-known elements have been illustrated in schematic or block diagram form in order not to obscure the invention in unnecessary detail. Additionally, for most parts, details regarding network communications, electromagnetic signal transmission techniques, etc., have been omitted since such details are not deemed necessary to gain a complete understanding of the invention and are considered to be within the skill of a person of ordinary skill in the art within the scope of understanding.

[0014] It should also be noted that all functions described herein may be performed in hardware or software, or some combination thereof, unless otherwise indicated. However, in a preferred em...

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PUM

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Abstract

The present invention provides for determining a temperature in a chip. A voltage across a thermal diode is generated. It is then determined whether the voltage across the thermal diode exceeds a threshold value. The voltage is correlated with a level of values. The determination of whether the voltage across the thermal diode exceeds the threshold value is correlated with the correlation of the voltage with a level of values. Through the use of voltage level sensors, the use of C4 input / output pins is avoided.

Description

technical field [0001] The present invention relates generally to temperature sensing, and more particularly to temperature sensing in integrated circuits. Background technique [0002] Very large scale integration (VLSI) chips can work with different designs and with more and more functions. However, this creates a temperature gradient in the chip. Also, when the workload changes, the die temperature also changes. Since the operating temperature can impose limits on allowable chip performance, it is often important to have a method of measuring the chip's operating temperature. The measured chip temperature can then be used to alter the chip environment (such as system fan speed or slower chip speed) to help ensure that the chip temperature remains within usage limits and over a long lifetime. [0003] In traditional technology, linear thermal diodes are used to measure the die temperature. Typically, a linear thermal diode has a constant voltage applied to it to hold t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01K7/01G01R31/26G01R31/28
CPCG01K7/01G01K1/02G01K2219/00
Inventor 戴维·W·伯斯特勒木原广巳罗伯特·P·帕特尼丹尼尔·L·斯塔西亚克迈克尔·F·王
Owner SONY COMPUTER ENTERTAINMENT INC