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Air-blowing type wafer heat radiation device and its device making method

A technology of a heat dissipation device and a manufacturing method, which is applied in the directions of electrical components, electric solid state devices, circuits, etc., can solve problems such as unfavorable forming, large material ratio, and limited application.

Inactive Publication Date: 2006-10-11
GETAC TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this material has a large specificity and is unfavorable for forming, which limits its application, and the above two materials are used for air cooling to dissipate heat. When the heat generation of the chip reaches 50W / cm 2 When the cooling method uses the above-mentioned copper and aluminum materials, it will be difficult to meet the heat dissipation requirements, so more efficient heat dissipation materials are required

Method used

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  • Air-blowing type wafer heat radiation device and its device making method
  • Air-blowing type wafer heat radiation device and its device making method
  • Air-blowing type wafer heat radiation device and its device making method

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Embodiment Construction

[0040] see figure 2 , in the figure, refers to a schematic diagram of a heat sink of an air-blown chip heat sink. It is an air-blown wafer heat dissipation device according to an embodiment of the present invention. The heat dissipation operation mode of the device is as described in the prior art, wherein the heat-conducting material combining a metal and a carbon element with a frame structure of the present invention is used as Make the material of the heat sink 21 . The lower surface 211 of the heat sink 21 and figure 1The upper plane 161 of the chip 16 indicated in the middle is bonded by the heat sink 12 to have a connection relationship, and has an upper surface 212 corresponding to the lower surface 211 of the heat sink 21 . This heat conduction reaction procedure is: the lower surface 211 of the heat sink 21 is connected to the upper plane 161 of the chip 16, and the temperature rise and heat generated by the operation of the chip 16 are conducted to the above-ment...

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Abstract

The air-blow wafer cooling device comprises an air-flow producing device, some cooling fins, a radiating fin, and a thermal conductive pipe. Wherein, the radiating fin is made by heat-conducting material included metal material and backbone-structure carbon with high thermal conductive coefficient, and can be prepared by CVD, PVD, electroplating or other method. This invention can decrease the hot temperature introduced by waste heat greatly for wide application.

Description

technical field [0001] The present invention relates to an air-blown wafer cooling device and its manufacturing method, in particular to a manufacturing method of a heat-conducting material comprising a metal and a frame-like carbon element. Background technique [0002] Recently, with the rapid development of the high-tech industry, electronic components are developing towards small size and high density, and the required efficiency is getting higher and higher, which is relatively accompanied by the generation of a lot of waste heat. If the waste heat cannot be removed in a timely manner, the performance of electronic components will be reduced, and even damage will be caused. In view of this, various heat-conducting materials have emerged as the times require, in order to achieve the purpose of improving heat dissipation efficiency. [0003] From the perspective of the prior art, copper or aluminum is usually the mainstream of the current heat dissipation technology as t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/34H01L23/427
Inventor 黄明汉郑裕强陈兆逸郭欣陇李秉蔚萧惟中李秉峰
Owner GETAC TECH CORP