Silicon chip transmitting system with CCD sensor and transmitting method thereof

Abstract

The present invention relates to a silicon wafer transmission device in semiconductor etching equipment and its transmission method. The invented silicon wafer transmission device with CCD sensor includes vacuum robot mounted in the vacuum transmission chamber interior and collinear array CCD sensor mounted outside of vacuum transmission chamber. The collinear array CCD sensor is used for detecting silicon wafer centre position and vacuum robot centre position condition after the silicon wafer is taken out by vacuum robot. Because the CCD sensor is mounted outside of the vacuum transmission chamber, so that the volume of said vacuum transmission chamber can be effectively reduced. Besides, said invention also provides the concrete steps of its transmission method by means of computer.

Description

technical field [0001] The present invention relates to a semiconductor etching device, in particular to a silicon wafer transfer device in the semiconductor etching device; the invention also relates to a transfer method using the transfer device. Background technique [0002] The role of some semiconductor equipment is to perform certain treatments on silicon wafers by physical and chemical means. This treatment is called semiconductor technology, and silicon wafers are usually processed in airtight containers in a vacuum environment. These containers are often referred to as reaction chambers. [0003] As a part directly connected to the reaction chamber, the vacuum transfer chamber, together with the vacuum manipulator inside it, needs to complete the work of accurately transferring the silicon wafer to be reacted to the reaction chamber in semiconductor production. The vacuum manipulator is driven by a stepping motor or a servo motor. After the silicon wafer is accurat...

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Problems solved by technology

[0007] The disadvantage of the above-mentioned prior art is that since the silicon wafer position measuring device 3 is to be installed in the vacuum transfer chamber 1, a certain space is occupied, so that the volume of the vacuum transfer chamber 1 is relatively large, resulting in a large overall volume of the semiconductor etching equipment. , occupies a large area and wastes resources; in addition, the vacuum manipulator needs to place the silicon wafer on the silicon wafer position measurement device for position calibration, and then take out the silicon wafer from the silicon wafer position measurement device and transfer it to the reaction chamber. The steps are cumbersome , long time, low efficiency

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