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Alkaline developable resin composition

A resin composition and developing technology, which can be used in photography, instruments, opto-mechanical equipment, etc., and can solve the problems of difficulty in obtaining graphic shapes and fine graphics, and insufficient sensitivity of photosensitive resin compositions.

Active Publication Date: 2006-11-08
ADEKA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the sensitivity of these known alkali-developable photosensitive resin compositions is insufficient, and it is difficult to obtain appropriate pattern shapes and fine patterns.

Method used

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  • Alkaline developable resin composition
  • Alkaline developable resin composition
  • Alkaline developable resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0075] [Example 1] Production of Alkaline Developable Resin Composition No.1

[0076] Production of 1,1-bis(4'-hydroxyphenyl)-1-(1"-biphenyl)-1-cyclohexylmethane

[0077] 70.5 g of biphenylcyclohexyl ketone, 200.7 g of phenol, and 10.15 g of thioacetic acid were added, and 40.0 g of trifluoromethanesulfonic acid was added dropwise at 18° C. over 20 minutes. After reacting at 17-19° C. for 18 hours, 500 g of water was added to stop the reaction, 500 g of toluene was added, the organic layer was washed with water until its pH reached 3-4, and the organic layer was separated. Toluene, water and excess phenol were distilled off. Toluene was added to the residue, and the precipitated solid was filtered, dispersed and washed with toluene to obtain 59.2 g of pale yellow crystals (51% yield). The melting point of the light yellow crystals was 239.5° C., and it was confirmed that the light yellow crystals were the target compound.

[0078] Production of 1,1-bis(4'-glycidoxyphenyl)...

Embodiment 2

[0083] [Example 2] Production of Alkaline Developable Resin Composition No.2

[0084] Add 43g 1,1-bis(4'-epoxypropoxyphenyl)-1-(1"-biphenyl)-1-cyclohexylmethane (compound a), 11g acrylic acid (compound b), 0.05g 2,6-di-tert-butyl-p-cresol, 0.11g tetrabutylammonium acetate and 23g propylene glycol-1-monomethyl ether-2-acetate were stirred at 120°C for 16 hours. Cooled to room temperature, added 35g propylene glycol-1-monomethyl ether-2-acetate and 16g biphenyltetracarboxylic dianhydride (compound d-1), stirred at 120°C for 8 hours.Add 0.7g tetrahydrophthalic anhydride ( Compound d-2), stirred at 120°C for 4 hours, stirred at 100°C for 3 hours, stirred at 80°C for 4 hours, stirred at 60°C for 6 hours, and stirred at 40°C for 11 hours, then added 29g of propylene glycol-1-mono Methyl ether-2-acetate, the target product alkali-developable resin composition No.2 (Mw=8100, Mn=2900, acid value (Solid content) is 89 mgKOH / g).

[0085] In addition, the reaction product contained in ...

Embodiment 3

[0086] [Example 3] Production of Alkaline Developable Resin Composition No.3

[0087] Add 43g 1,1-bis(4'-epoxypropoxyphenyl)-1-(1"-biphenyl)-1-cyclohexylmethane (compound a), 11g acrylic acid (compound b), 0.05g 2,6-di-tert-butyl-p-cresol, 0.11g tetrabutylammonium acetate and 23g propylene glycol-1-monomethyl ether-2-acetate were stirred at 120°C for 16 hours. Cooled to room temperature, added 35g of propylene glycol-1-monomethyl ether-2-acetate, 16g of biphenyltetracarboxylic dianhydride (compound d-1) and 39mg of tetra-n-butylammonium bromide were stirred at 120°C for 4 hours, and at 100°C Stir for 3 hours, stir at 80°C for 4 hours, stir at 60°C for 6 hours, and stir at 40°C for 11 hours, add 29g of propylene glycol-1-monomethyl ether-2-acetate to obtain propylene glycol-1-monomethyl Alkaline developable resin composition No. 3 (Mw = 8600, Mn = 3000, acid value (solid content) 87 mgKOH / g) of the target product in the ether-2-acetate solution form.

[0088] In addition, the...

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Abstract

Disclosed is an alkaline developable resin composition containing a reaction product obtained by esterifying a polybasic acid anhydride (D) with respect to an epoxy adduct having a structure wherein an unsaturated monobasic acid (B) and a compound (C) selected from phenol compounds, alcohol compounds, amine compounds and carboxylic acids are added to an epoxy resin (A) represented by the following general formula (I). (In the formula, Cy represents a C3-5 cycloalkyl group; X represents H, a C1-10 alkyl group or the like; Y and Z respectively represent a C1-10 alkyl group or the like; n represents a number of 0-10; p represents a number of 0-5; and r represents a number of 0-4.)

Description

technical field [0001] The present invention relates to an alkali-developable resin composition containing a specific compound having an ethylenically unsaturated bond, and an alkali-developable photosensitive resin composition containing a photopolymerization initiator in the alkali-developable resin composition . Background technique [0002] The alkali-developable photosensitive resin composition includes an alkali-developable resin composition containing a compound having an ethylenically unsaturated bond and a photopolymerization initiator, and the alkali-developable photosensitive resin composition can be irradiated with ultraviolet rays or electron rays. It is polymerized and cured, so it is used in photocurable inks, photosensitive printing plates, printed circuit wiring boards, and various photoresists. Recently, along with the development of thinner, thinner, and higher performance electronic devices, an alkali-developable photosensitive resin composition capable ...

Claims

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Application Information

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IPC IPC(8): G03F7/027C08F290/06H05K3/28
CPCG03F7/027C08F290/06H05K3/28
Inventor 阿久津光男清水正晶真壁由惠佐藤直美石黑智仁君岛孝一前田直树
Owner ADEKA CORP
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