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Signal transmission method of integrated conductive probe and finished product thereof

A conductivity probe and transmission method technology, applied in the field of test probes, can solve problems affecting signal transmission efficiency and quality, high resistance value, large inductance effect, etc.

Inactive Publication Date: 2006-11-22
范盛奎 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The manufacturing, assembly, and metal plating of its constituent components cost a lot of money, and when the probe transmits electronic signals, the more components the signal passes through, the higher the resistance value will be. The second technology has this shortcoming
In addition, prior art 2 also has the disadvantage of large inductance effect when used, the reason for which is briefly described later
[0008] see again image 3 As shown, during the test of the probe, the electronic signal transmitted by it must pass through the spring member, and when the spring in the general probe is compressed, the coils are still loose, so the electronic signal will follow the coil when passing through. The helical structure path flows, not only the resistance value is proportional to the path length, but also affects the transmission efficiency and quality of the signal due to the large inductance effect, it is necessary to further improve

Method used

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  • Signal transmission method of integrated conductive probe and finished product thereof
  • Signal transmission method of integrated conductive probe and finished product thereof
  • Signal transmission method of integrated conductive probe and finished product thereof

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Embodiment Construction

[0026] Please see first Figure 4 ~ Figure 9 As shown, the signal transmission method and the finished product of the integrally formed conductance probe of the present invention are an elastic body 10 in which a conductive metal wire is wound into a number of helical coils. Parts 11, 11', the coils of the two connecting parts 11, 11' change from small to large in diameter, and a connecting section 111 in the shape of a bell mouth is formed at one end, so that it has the function of micro-elasticity, or the coil The structure is equal in diameter, and the coils can be in dense contact structure or elastic loose structure when the connecting parts 11 and 11' are wound, and the structure change of elastic loose or dense contact depends on the Depends on usage needs. Secondly, an elastic section 12 with elastic recovery force is wound around the two connecting parts 11, 11'. The elastic section 12 is of general spring structure, which can generate an elastic recovery force after...

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Abstract

The disclosed conductive probe comprises an integrated-forming elastic body to transfer signal. Wherein, winding a coil for every end with diameter gradual larger and some micro-spring as conductive part to form a spring segment, winding a reed segment at proper position of the spring segment by large-small-large structure. This invention can reduce cost greatly, increases probe spring, and decreases resistance and inductance.

Description

technical field [0001] The invention relates to the technical field of a testing probe, in particular to a method and structure for signal transmission using an integrated probe. Background technique [0002] At present, probes have been widely used in various testing fields, such as printed circuit board testing, wafer testing, IC packaging testing, communication products and LCD panel testing, etc., all of which require probes as the testing medium. In addition, at this stage, the probe is gradually developing towards fine electronic components, mainly because the size of the probe is becoming more and more fine, and it has the advantages of conductivity and low resistance, so it will give the probe the function of high-frequency signal transmission , and can be used as a transceiver antenna for wireless communication products such as mobile phones and a connection point for chargers and connectors of various electronic products. Future probes will no longer only play the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/067G01R31/00
Inventor 周万全范伟芳刘荣灿
Owner 范盛奎