Semiconductor module including circuit device and insulating film, method for manufacturing same, and application of same

A technology for circuit components and manufacturing methods, which is applied in the fields of semiconductor/solid-state device manufacturing, electrical components, semiconductor devices, etc., can solve problems such as the difficulty in achieving miniaturization, thinning, light weight, and improvement of heat dissipation for portable electronic devices, etc. Achieve the effect of improving electron migration resistance, improving manufacturing stability, and simplifying manufacturing process

Inactive Publication Date: 2006-11-22
SANYO ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, in these conventional CSPs, it is difficult to achieve the level of miniaturization, thinning, and weight reduction currently desired in portable electronic devices and the like.
In addition, there is a limit to the improvement of heat dissipation

Method used

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  • Semiconductor module including circuit device and insulating film, method for manufacturing same, and application of same
  • Semiconductor module including circuit device and insulating film, method for manufacturing same, and application of same
  • Semiconductor module including circuit device and insulating film, method for manufacturing same, and application of same

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0130] Figure 4 (a)~ Figure 4 (f) is a sectional view showing the manufacturing process of the semiconductor module according to the first embodiment of the present invention.

[0131] First, if Figure 4 As shown in (a), circuit elements such as a plurality of semiconductor elements 142 and passive elements 144 are fixed on the substrate 140 . Here, the substrate 140 has adhesiveness, and can constitute a tape-shaped substrate on which the semiconductor element 142 and the passive element 144 can be fixed. In addition, the base material 140 may be formed of a material that can be peeled off from the insulating resin film 122 after the semiconductor element 142 and the passive element 144 are embedded in the insulating resin film 122 . As such a material, for example, a PET film or the like can be used.

[0132] The semiconductor element 142 is, for example, a transistor, a diode, an IC chip, or the like. In addition, the passive element 144 is, for example, a chip capa...

no. 2 example

[0157] Figure 5 (a)~ Figure 5 (d) is a sectional view showing the manufacturing process of the semiconductor module according to the second embodiment of the present invention. In this embodiment, the same symbols are used for the same constituent elements as those in the first embodiment, and description thereof is appropriately omitted. This embodiment differs from the first embodiment in that a stretchable material is used as one of the base materials 140 . As the base material 140 in this embodiment, for example, a PET film can be used.

[0158] Such as Figure 5 As shown in (a), after a plurality of semiconductor elements 142 and passive elements 144 are fixed on the substrate 140, the substrate 140 is stretched laterally in the figure. Then, if Figure 5 As shown in (b), in the state where the substrate 140 is stretched, the insulating resin film 123 with a conductive film is placed on the substrate 140, and the semiconductor element 142 and the passive element 14...

no. 3 example

[0161] Figure 6 (a)~ Figure 6 (d) is a sectional view showing the manufacturing process of the semiconductor module according to the third embodiment of the present invention. In this embodiment, the same symbols are used for the same components as those in the first embodiment and the second embodiment, and description thereof is appropriately omitted. In this embodiment, the semiconductor element 142 and the passive element 144 are pressed into the insulating resin film 122 in the state where the base material 140 for fixing the semiconductor element 142 and the passive element 144 is placed on the support table 146, and The thermocompression curing of the insulating resin film 122 is different from the first and second embodiments in the above respects.

[0162] Such as Figure 6 As shown in (a), after a plurality of semiconductor elements 142 and passive elements 144 are fixed on the base material 140 , the base material 140 is placed on the support table 146 . The s...

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PUM

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Abstract

As shown in Figs. 4(a)-4(e), a plurality of semiconductor devices (142) and passive devices (144) are fixed to a base (140), then an insulating resin film (123) with conductive film composed of a conductive film (120) and an insulating resin film (122) is pressed against the base (140) so that the semiconductor devices (142) and the passive devices (144) are pushed into the insulating resin film (122), and the base (140) and the insulating resin film (123) are contact-bonded under vacuum or a reduced pressure. Following that, the base (140) is separated from the insulating resin film (122), and a via (121) is formed and the conductive film (120) is patterned. Consequently, there can be obtained a structure (125) wherein one side of each semiconductor device (142) and passive device (144) is sealed with the insulating resin film (122) while the other side of each device is exposed.

Description

technical field [0001] The present invention relates to a semiconductor module and a semiconductor device including circuit elements, their manufacturing methods, and a display device including optical elements. Background technique [0002] As the performance of portable electronic devices such as mobile phones, PDAs, DVCs, and DSCs is accelerating, in order for such products to be accepted by the market, it is necessary to make them smaller and lighter. To achieve this smaller and lighter, a highly integrated system is required. LSI. On the other hand, these electronic devices are required to be easier to use and more convenient, and LSIs used in the devices are required to have higher functionality and higher performance. Therefore, with the high integration of LSI chips, the number of I / Os increases, and the miniaturization of the package itself is required. In order to meet these conditions at the same time, there is a strong demand for semiconductor packages suitable ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/00G02F1/1345H01L21/56H01L21/60H01L21/98H01L23/31H01L23/538H01L25/16
CPCH01L21/568H01L23/3128H01L23/5389H01L24/45H01L24/85H01L24/96H01L24/97H01L25/16H01L25/50H01L2224/24137H01L2224/24195H01L2224/45144H01L2224/48091H01L2224/48227H01L2224/49171H01L2224/82001H01L2224/85001H01L2224/97H01L2924/01006H01L2924/01013H01L2924/01014H01L2924/01015H01L2924/01027H01L2924/01029H01L2924/01033H01L2924/01047H01L2924/0105H01L2924/01073H01L2924/01078H01L2924/01079H01L2924/01082H01L2924/04953H01L2924/10329H01L2924/12044H01L2924/14H01L2924/15192H01L2924/15311H01L2924/19041H01L2924/19043H01L2924/19105H01L2924/30105H01L24/48H01L24/49H01L2924/00014H01L2924/01005H01L2924/01023H01L2924/01024H01L2924/01076H01L2924/014H01L2924/12041H01L2224/32225H01L2224/73267H01L2224/92244H01L2924/18162H01L2224/24146H01L2224/32145H01L2224/04105H01L2224/12105H01L2924/15788H01L2924/181H01L2224/85203H01L2224/05554H01L2924/3511H01L2224/85H01L2224/78H01L2924/00H01L2924/00012H01L23/522H01L25/03H01L21/56
Inventor 臼井良辅井上恭典
Owner SANYO ELECTRIC CO LTD
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