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Lead free solder friendly thermoplastic blends and methods of manufacture thereof

A plastic and warm technology, applied in the field of solder-resistant high-temperature thermoplastic compositions, can solve the problems of thermoplastic compositions no longer reliable, loss of insulation capacity, etc., and achieve the effect of improving thermal performance and improving high-temperature performance

Inactive Publication Date: 2007-01-10
SABIC GLOBAL TECH BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For these types of applications, the loss of insulating capacity (usually following failure) renders the thermoplastic composition unreliable

Method used

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  • Lead free solder friendly thermoplastic blends and methods of manufacture thereof
  • Lead free solder friendly thermoplastic blends and methods of manufacture thereof
  • Lead free solder friendly thermoplastic blends and methods of manufacture thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0052] These examples illustrate the advantageous properties of high temperature thermoplastic compositions comprising poly(arylene ether) having an intrinsic viscosity of less than 0.15 dl / g. Sample 1 contained a low intrinsic viscosity polyphenylene ether (PPE) with an intrinsic viscosity of 0.12 dl / g; however, Sample 2 was a comparative example that contained a PPE with an intrinsic viscosity of 0.4 dl / g. Both PPE samples were manufactured by GE Plastics. The polyphenylene sulfide (PPS) is commercially available from Ticona Corporation as FORTRON 214  . This flow enhancer (lubricant) is available from Lonza Inc under the trade name GLYCOLUBE  Pentaerythritol stearate (PETS) obtained. The glass fibers used were E-glass fibers obtained from Johns Manville. The glass fibers have a diameter of 13 microns and a length of approximately 3 mm. Table 1 below shows the respective detailed data of the components of Sample 1 and Sample 2.

[0053] The components of each lead-fr...

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Abstract

Disclosed herein is a high temperature thermoplastic composition comprising a polyarylene ether consisting essentially of plurality of structural units of the formula (I), wherein for each structural unit, each Q<1> and Q<2> are independently a halogen, a primary or secondary lower alkyl, a phenyl, a haloalkyl, an aminoalkyl, a hydrocarbonoxy, a halohydrocarbonoxy wherein at least two carbon atoms separate the halogen and oxygen atoms, and wherein the polyarylene ether has an intrinsic viscosity of less than or equal to about 0.15 deciliters per gram; a polyarylene sulfide; and glass fibers.

Description

Background of the invention [0001] The present disclosure relates to solder resistant high temperature thermoplastic compositions and methods of making the same. [0002] As miniaturization of products and improvement of productivity are desired in the electronics industry, soldering methods for resin electronic parts for fixing parts such as connectors, switches, relays and bobbins to printed circuit boards have been developed. This method has been named "surface-mount" technique. [0003] The term "surface-mount" as used herein refers to a mounting system in which electronic components are secured to a printed circuit board. A creamy lead-free solder is used to facilitate the adhesion of the electronic component to the printed circuit board. Thermoplastic compositions are also commonly used as insulating materials for electronic components. The printed circuit board is then passed through an oven (re-flow oven), thereby melting the solder to fix the electronic component t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08K7/14C08L81/02C08L71/12
Inventor B·L·刘
Owner SABIC GLOBAL TECH BV
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