Processor, multiprocessor system, processor system, information processing device, and temperature control method

Abstract

An instruction decoder 14 identifies, for each instruction, an operational block involved in the execution of the instruction and an associated heat release coefficient. The instruction decoder stores identified information in a heat release coefficient profile 20. An instruction scheduler 16 schedules the instructions in accordance with the dependence of the instructions on data. A heat release frequency adder 32 cumulatively adds the heat release coefficient to the heat release frequency of the operational block held in the operational block heat release frequency register 22 as the execution of the scheduled instructions proceeds. A heat release frequency subtractor 34 subtracts from the heat release frequency of the operational blocks in the operational block heat release frequency register 22 in accordance with heat discharge that occurs with time. A hot spot detector 36 detects an operational block with its heat release frequency, held in the operational block heat release frequency register 22, exceeding a predetermined threshold value as a hot spot. The instruction scheduler 16 delays the execution of the instruction involving for its execution the operational block identified as a hot spot.

Description

technical field [0001] The invention relates to processor technology, in particular to a processor capable of controlling heat generation, a multi-processor system, a processor system, an information processing device and a temperature control method. Background technique [0002] In LSI design, the miniaturization of the manufacturing process and the high integration of components are further progressing, and it is very important to consider the heat generation as the performance limit of the chip in the design. When the chip is at a high temperature, it will cause malfunction or lower long-term reliability, so various heat generation countermeasures are taken. For example, a cooling fan is provided above the chip to dissipate heat generated from the chip. [0003] Furthermore, since the distribution of power consumption on the chip is not uniform, the problem of a so-called "hot spot" in which a part of the chip becomes abnormally high in temperature cannot be avoided. T...

AI Technical Summary

Problems solved by technology

Conventional heat generation countermeasures are to macroscopically observe the temperature distribution of the entire chip and spend a few seconds to a minute to dissipate heat, and the time response is not good.

In the recent highly integrated LSI, a chip is designed that consumes about tens of watts of power in one chip. If the heat release process is not performed with an instruction of tens of microseconds, it will cause malfunction due to a sharp temperature rise.

Although heat is generated locally, when the temperature of the entire chip is at a safe temperature, if the operating frequency of the chip is lowered, the overall processing performance of the processor will be sacrificed, which is inefficient.

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