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Stabilized decoating liquid

A deplating solution and stable technology, applied in the field of deplating solution, can solve the problems of increasing production cost, shortening the service life of deplating solution, corrosion of plastic materials, etc., and achieve the goal of increasing service life, reducing production cost and increasing deplating speed Effect

Inactive Publication Date: 2007-01-17
MITAC PRECISION TECH CO LTD SHUNDE DISTRICT FOSHAN CITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, often adopt the sulfuric acid (H 2 SO 4 ) and nitric acid (HNO 3 ) of the stripping solution for deplating, the above-mentioned stripping solution is likely to have an adverse effect on the plastic material itself due to the presence of strong oxidant nitric acid during deplating. In addition, it is also due to the existence of strong oxidant nitric acid. Metal reaction, nitric acid is not only a strong oxidant, but also acts as an acid, especially under heating conditions, nitric acid is reduced, resulting in a large amount of NO 2 Yellow smoke pollutes the air, causes harm to the human body, and is also seriously corrosive to the plant and equipment
In order to overcome the above deficiencies, the inventor invented a solution to replace nitric acid with hydrogen peroxide, that is, invented a deplating solution with sulfuric acid and hydrogen peroxide as the main components. This deplating solution solved the above technical problems very effectively, but due to the The copper ions will quickly decompose the hydrogen peroxide, which greatly shortens the service life of the deplating solution and increases the production cost.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0008] A stable deplating solution, which includes sulfuric acid and hydrogen peroxide, the content of sulfuric acid is 98% sulfuric acid 180g / L; the content of hydrogen peroxide is 27.5% hydrogen peroxide 30g / L, and also includes the stabilizer n-C that prevents the decomposition of hydrogen peroxide and accelerates the deplating speed 4 H 9 NH 2 , N-C 4 H 9 NH 2 The content is 10g / L.

[0009] The content of the above-mentioned sulfuric acid can also be 98% sulfuric acid 50g / L, 150g / L, 200g / L or 500g / L; the content of hydrogen peroxide can also be 27.5% hydrogen peroxide 10g / L, 25g / L, 35g / L or 100g / L ; NC 4 H 9 NH 2 The content can also be 8g / L, 12g / L or 15g / L.

[0010] In the above deplating solution, the stabilizer can also be n-C alone 8 H 17 NH 2 , Can also be n-C 8 H 17 NH 2 And n-C 4 H 9 NH 2 Both reagents exist at the same time as stabilizers.

Embodiment 2

[0012] A stable deplating solution. Compared with Example 1, it can also include an anti-dyeing salt that can remove the copper layer and nickel without corrosive to the plastic surface. The anti-dyeing salt is sodium m-nitrobenzene sulfonate. The content of sodium nitrobenzene sulfonate is 50g / L.

[0013] The content of the foregoing sodium m-nitrobenzene sulfonate can also be 30 g / L, 80 g / L or 150 g / L.

[0014] Example 2 When the deplating solution is in use, due to the stabilizer n-C 4 H 9 NH 2 The existence of the deplating solution can effectively reduce the rapid decomposition of dissolved copper ions on hydrogen peroxide, significantly increase the use cycle of the deplating solution, reduce production costs, and accelerate the deplating speed of metallic nickel and copper. In order to improve efficiency; to further prevent the inclusion of sodium m-nitrobenzene sulfonate, combined with other ingredients can remove the copper layer and nickel, and at the same time have a pr...

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PUM

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Abstract

A stable deplating liquid that contains sulfuric acid and hydrogen peroxide, and a stabilizer blocking the degration of hydrogen peroxide and increasing the deplating rate containing either one or the composite of n-C4H9NH2 and n-C8H17NH2, The mentioned stabilizer may also contains the reserve salt containing sodium m-nitro-benzenesulfonate(O2N-C6H4-SO3Na) that can strip copper or nickel layer without eroding plastic surface. In this stable deplating liquid, presence of the stabilizer can inhibit the rapid degration of hydrogen peroxide catalyzed by copper ion, increase the service time of the liquid, decrease the cost and increase the deplating rate of nickel and copper. Furthermore, the contained sodium m-nitro-benzenesulfonate will remove copper layer and nickel and protect the plastic surface from corrosion in combination with other components.

Description

Technical field [0001] The invention relates to a deplating solution, in particular to a stable deplating solution, which is mainly suitable for removing the copper plating layer or the nickel plating layer on the surface of a plastic product. Background technique [0002] In order to make plastic products beautiful and durable, and to increase the added value of the product, electroless copper or electroless nickel plating is often used on the surface of the plastic product to metalize the surface of the plastic product. In order to recycle the above-mentioned defective or waste products with metallization on the surface, the metal layer needs to be removed, that is, stripping. In the prior art, sulfuric acid containing high concentration (H 2 SO 4 ) And nitric acid (HNO 3 ) For deplating. Due to the presence of the strong oxidant nitric acid, the above-mentioned deplating solution is likely to have an adverse effect on the plastic material itself during deplating. In addition, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/16C23F1/18
Inventor 陈其亮
Owner MITAC PRECISION TECH CO LTD SHUNDE DISTRICT FOSHAN CITY
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