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Hot melt adhesion technique

A hot-melt bonding and hot-pressing technology, applied in the field of bonding technology, can solve problems such as the failure of connecting parts to meet the requirements, uneven distribution of bonding materials, unstable process, etc., saving operation time and shortening bonding completion time. , process stable and reliable effect

Active Publication Date: 2007-02-28
领胜电子科技(深圳)有限公司
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Problems solved by technology

These traditional processes generally have the defects of unstable process and weak adhesion (such as the above-mentioned process), which leads to quality problems
However, the use of dispensing glue, liquid adhesive and other viscose methods requires the addition of solvents, which will cause unfriendly environment and fire hazards. Uneven material distribution, overflowing glue (such as the above-mentioned dispensing) and other defects

Method used

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Embodiment Construction

[0037] The invention provides a hot-melt bonding process with stable and reliable process, short time and high final bonding quality.

[0038] The structural features and advantages of the present invention will be described in detail below by taking the application of this process to bond a metal ring on the shell of a mobile phone as an example.

[0039] The invention relates to a hot-melt bonding hot-pressing process, which is to heat the thermoplastic polymer film material of the fiber-reinforced structure without hardening treatment as an adhesive film to a molten state, and in this state, the adhesive film serves as a connecting link with the adhesive film. The two parts to be bonded are welded, and when cooled to normal temperature, the adhesive film in the molten state solidifies and hardens, and is firmly bonded to the parts to be bonded, thereby forming a connection between the two parts to be bonded. As shown in Figure 1 and Figure 2, the present invention mainly co...

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Abstract

The invention relates the hot melt adhesion technology, comprising the following steps: a heat composite; b cutting; c stitching; d up-stripping and checking; e heat pressing; f checking. The technology can separately control temperature, press and time, has no solvent and environmental pollution; its binding power is ten times than that of pressure-sensitive adhesive; the technology can accurately control the quantity, position and shape of adhesive material; the technology has fast curing speed, short adhesion time; the product made with the technology has advantages of high strength and good property.

Description

【Technical field】 [0001] The invention relates to a connection process, in particular to a process method for bonding two parts to each other by hot melting. 【Background technique】 [0002] At present, the connection between metal parts and non-metallic material parts, such as the connection with plastic, glass and other parts, traditionally adopts glue point bonding, metal screw connection, ultrasonic welding, liquid adhesive, pressure sensitive adhesive and other connection methods. These traditional processes generally have the defects of unstable process and weak adhesion (such as the above-mentioned process), thus causing quality problems. However, the use of dispensing glue, liquid adhesive and other viscose methods requires the addition of solvents, which will cause unfriendly environment and fire hazards. Uneven material distribution, overflowing glue (such as the above-mentioned dispensing) and other defects. 【Content of invention】 [0003] The utility model aim...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J5/06
Inventor 田悦明
Owner 领胜电子科技(深圳)有限公司
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