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Multi-layered wiring board, fabricating method, electronic device and electronic instrument

A technology of multilayer circuit board and manufacturing method, which is applied in the direction of multilayer circuit manufacturing, electric solid-state devices, circuits, etc., can solve the problems of wiring layer disconnection, reduced use efficiency, and unevenness of the upper part of the inner layer insulating film, etc., and achieve excellent Insulation performance, avoiding open circuit, and uniform film thickness

Inactive Publication Date: 2007-03-28
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Then, in the wiring layer, the inner layer insulating film is formed in conformity with the uneven circuit pattern, and the flatness of the inner layer insulating film is insufficient.
With such an uneven interlayer insulating film, the upper part of the interlayer insulating film is also uneven, so that a flat wiring layer cannot be formed.
In addition, the cross-sectional shape of the upper inner layer insulating film or wiring layer will also be affected, resulting in disconnection between the wiring layers.
If the substrate is rotated, the material usage efficiency will be reduced and additional processes such as cleaning the backside will be required

Method used

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  • Multi-layered wiring board, fabricating method, electronic device and electronic instrument
  • Multi-layered wiring board, fabricating method, electronic device and electronic instrument
  • Multi-layered wiring board, fabricating method, electronic device and electronic instrument

Examples

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no. 1 example

[0081] 1A-3C are schematic diagrams showing various processes of the method for manufacturing a multilayer circuit board according to the first embodiment of the present invention. 1A-1H show the various processes from the ink repellent coating process to the process of forming the first circuit pattern (ie, the first wiring layer) and the inner layer conductive pillars. 2A-2H show the process of forming the first interlayer insulating film. 3A-3C illustrate forming a second circuit pattern (ie, a second wiring layer). The respective processes of the second interlayer insulating film and the third circuit pattern (ie, the third wiring layer). In the present embodiment, multilayer printed wiring is formed on one surface of the substrate 10 .

[0082] 4A and 4B are schematic diagrams showing a droplet discharge apparatus used in a method of fabricating a multilayer circuit board. Fig. 4A is a perspective view showing the general structure of the droplet ejection device, and F...

no. 2 example

[0148] Fig. 6 is a schematic view showing a step in a method of manufacturing a multilayer circuit board according to a second embodiment of the present invention. In this embodiment, instead of the calculation process of the insulating film formation area in the first embodiment, the measurement process of the insulating film formation area is carried out. Other processes are the same as those of the first embodiment.

[0149] Processes different from those of the first embodiment will be described in detail below. Regarding other processes, only a series of flows of the respective processes of forming a multilayer circuit board will be described. In FIG. 6, the same parts as those in FIGS. 1A to 4B are given the same reference numerals.

[0150] In the multilayer circuit board manufacturing method of the present embodiment, (i) the ink repelling process to the substrate 10, (ii) the first circuit pattern forming process, and (iii) the inner layer conductive column forming ...

no. 3 example

[0167] 8A to 8E are schematic diagrams showing various steps in the manufacturing method of the multilayer circuit board according to the third embodiment of the present invention. In this embodiment, a plurality of inner-layer insulating films are formed, and after the first inner-layer insulating film is formed, each height difference in the upper surface of the first inner-layer insulating film is measured, and the second inner layer is formed according to the measured data. insulating film to make the upper surface of the first inner layer insulating film flat.

[0168] Only the processes different from those of the first and second embodiments will be described in detail below. Regarding other processes, only a series of flows of the respective processes of forming a multilayer circuit board will be described. In FIGS. 8A to 8E, the same parts as those in FIGS. 1 to 7 are given the same reference numerals.

[0169] In the multilayer circuit board manufacturing method of...

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Abstract

A multilayer circuit board and a manufacturing method for producing the board via simple manufacturing processes employing a droplet jetting method, where the inter-layer insulating film can be easily made flat. The multilayer circuit board includes at least two wiring layers, an inter-layer insulating film provided between every adjacent two of the wiring layers, and conductive posts for providing electrical conductivity between the wiring layers. The manufacturing method includes the step of forming the inter-layer insulating film by changing the film thickness of the inter-layer insulating film according to a concavo-convex shape of an area where the inter-layer insulating film is formed, so as to level an upper surface of the inter-layer insulating film. The concavo-convex shape may be computed based on design data of a circuit pattern for forming the wiring layers and the conductive posts, or may be measured before the inter-layer insulating film is formed.

Description

[0001] This application is a divisional application with the application number CN 200310118114.8, the application date is November 13, 2003, the applicant is Seiko Epson Co., Ltd., and the title is "multilayer circuit board and its manufacturing method, electronic device and electronic device". The above-mentioned earlier application claims priority of which— [0002] Country of the earlier application Date of the earlier application Number of the earlier application [0003] Japan 2002.11.19 JP 2002-334915 [0004] Japan 2003.08.25 JP 2003-300143 [0005] The content of the priority application is incorporated herein by reference. technical field [0006] The invention relates to a multilayer circuit board, a manufacturing method, an electronic device and an electronic device. Background technique [0007] In general, inner layer insulating films used in multilayer printed circuit boards are generally produced by spin coating or roll coating. According to the spin coat...

Claims

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Application Information

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IPC IPC(8): H05K3/46H01L21/48H01L23/12H05K1/18
CPCH01L2224/11
Inventor 桜田和昭
Owner SEIKO EPSON CORP