Embedding method for printed circuit board and printed circuit board

A printed circuit board, the first technology, applied in the direction of printed circuit, printed circuit manufacturing, printed circuit assembly of electrical components, etc., can solve the problems of unfavorable promotion and application, high production cost, expensive price, etc., to improve flexibility, The effect of saving process and cost

Inactive Publication Date: 2007-04-11
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The disadvantage of the prior art is that the dielectric material with high dielectric constant is expensive and costly, resulting in a correspondingly high production cost of this PCB, which is not conducive to widespread promotion and application.

Method used

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  • Embedding method for printed circuit board and printed circuit board
  • Embedding method for printed circuit board and printed circuit board

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Embodiment Construction

[0023] The present invention is further elaborated below in conjunction with accompanying drawing and embodiment:

[0024] Refer to FIG. 1 for the flow chart of the method for embedding capacitance on a PCB in the present invention. The present invention can be embedded in any position on the PCB, and the specific process is as follows:

[0025] The first step: by means of electroplating or etching, a first metal layer is provided on the first surface of the power supply layer to increase the thickness of the metal, and a second metal layer is provided on a corresponding area on the first surface of the ground layer parallel to the power supply layer to Increase the metal thickness in this area; thereby reducing the distance between the power supply layer and the ground layer in this area, which is conducive to the formation of plate capacitance; wherein, the corresponding area is located on the first surface of the ground layer with an area opposite to the first metal layer, ...

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PUM

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Abstract

This invention relates to a capacitance hidden method of a PCB and a PCB, in which, the method includes: a first metal layer is set on a first surface of a supply layer, a second metal layer is set on the related region of the first surface of the ground layer parallel to the supply layer, a medium material is added between the first layers of the supply layer and the ground layer to stitch the PCB including mutual parallel supply layer and the ground layer and a medium layer, a fist metal layer, a second metal layer, at least one metal post and at least one through hole filled between the first surfaces of the supply layer and the ground layer.

Description

[technical field] [0001] The invention relates to the field of printed circuit boards, in particular to a method for embedding a printed circuit board and the printed circuit board. [Background technique] [0002] As the PCB (Printed Circuit Board) realizes more and more functions, there are more and more corresponding electronic devices on the PCB, and the remaining space available on the PCB is getting smaller and smaller. If new functions are to be added on the PCB, it is often given up due to the space limitation on the PCB, or after adding new functions on the PCB, the volume of the PCB is too large, which is not conducive to product assembly. [0003] Today's electronic products are developing in the direction of miniaturization, and the same requirements are also required for PCBs, that is, to increase the density of the external electronic components of the PCB, or to reduce the number of electronic components installed on the PCB, so as to obtain a highly integrated...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/30H05K3/00H05K1/18H05K1/00
Inventor 刘涛叶青松刘卫东
Owner HUAWEI TECH CO LTD
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