Around exposure device irradiated by laser beam and uv-ray, and method thereof

Abstract

The present invention provides a peripheral exposure device irradiated by laser beam and UV-ray, and a method thereof which are adapted to the condition that the identification mark forms at any position of the peripheral region. The device comprises a dado 2 for keeping the substrate W, a photo device 4 for capturing an image data by shooting the locating mark set for aligning the predefined position on substrate to predefined standard position on dado, a movable convey mechanism 3 which can move the dado, a laser beam unit 5 which can emit laser beam on the moving path of the movable convey mechanism, a uv-ray irradiating unit 9 for irradiating the light containing uv-ray to the peripheral region through the irradiating opening, and a control device 20 for controlling the convey mechanism, which can achieve the adjusting of the substrate based on the image data captured by photo device and can make the exposure of identification mark using laser beam and the exposure of peripheral region using light containing UV-ray happening at the same time.

Description

technical field [0001] The present invention relates to a peripheral exposure device and method for irradiation of laser beams and ultraviolet rays. The device and method irradiate a peripheral area formed around a pattern area of ​​a substrate with a laser beam to expose identification marks such as marks and characters (marking) ), and at the same time, the peripheral area is irradiated with light containing ultraviolet rays to perform peripheral exposure. Background technique [0002] Generally speaking, regarding a substrate to be exposed with a pattern in an exposure device, for example, in a liquid crystal substrate, a substrate with a size of about 500mm x 500mm was processed at that time, and a substrate with a large size of 2160mm x 2460mm is now being enlarged. to process. This large substrate is cut and separated into predetermined individual substrate pieces to manufacture a substrate mounted on a general image receiving device. When the substrate is cut and se...

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Problems solved by technology

[0017] However, since the alignment work of the substrate is performed by determining the absolute position in each exposure apparatus, the references of each alignment work are different, and the structure cannot be simply integrated.

[0018] (2) Moreover, when the exposure process of the identification mark and the exposure process of the surrounding area are continuously performed, the moving speed of the substrate will affect the exposure speed of any exposure process.

However, as in Patent Document 4, when the irradiated exposure light beam expands or contracts symmetrically with respect to the center of the optical path, if the identification mark is located at a position close to the pattern area side from the center of the peripheral area, it cannot be dealt with, and it has to be compared. There is a case where the movement direction of the pedestal is shifted and the exposure is exposed, so it is desired to improve this situation

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