Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Lead frame for direct connected chip packaging

A technology of chip packaging and lead frame, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of chip circuit damage, large current limit, poor heat dissipation, etc., to reduce the electrical impedance rate, improve Current capacity, heat dissipation capability, cost reduction effect

Inactive Publication Date: 2007-07-04
JCET GROUP CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Disadvantages are: high electrical impedance, large current limit and poor heat dissipation
[0004] 2. Both the base island and the gold wire soldering pin need to be plated with silver
The disadvantage is: the cost of silver plating is high, and the scrap rate due to poor silver plating is also high
The disadvantage is that the parameters of each operation are limited. A little carelessness will cause damage to the chip surface and internal circuits of the chip, and the parameters need to be re-modified due to different chip thicknesses and different gold wire diameters.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Lead frame for direct connected chip packaging
  • Lead frame for direct connected chip packaging
  • Lead frame for direct connected chip packaging

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] As shown in FIG. 3 , the present invention is a lead frame for direct connection type chip packaging. The signal guiding lead pin 3.2 of the metal lead frame 3 is made into a spring pin, and the lead pin 3.2 is provided with a connection hole 3.2.1.

[0018] As shown in Figures 4-5, Figures 4-5 show a direct-connected chip packaging structure of the present invention. It consists of a functional chip 1, a conductive or non-conductive glue 2 for connecting the chip and the carrier base island, a metal lead frame 3, and a plastic encapsulant 5 for protection. The functional chip 1 is placed on the carrier base island 3.1 of the metal lead frame 3, the back of the chip 1 and the carrier base island 3.1 are connected by conductive or non-conductive glue 2, and the signal guide pin 3.2 of the metal lead frame 3 is made into a spring Pin, lead pin 3.2 is provided with connection hole 3.2.1, the pin end of lead pin 3.2 is placed on the front of chip 1, and the pin end of lead...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

This invention relates to a direct link chip package with leading-line frame, and its characteristic is producing spring feet at the leading line feet (3.2) of the leading line frame (3). The invention can reduce electrical impedance, improving current and heating radiation capacity, lower costs, no need to adjust parameters part, and connecting firmly.

Description

Technical field: [0001] The invention relates to a chip package structure, in particular to a lead frame for direct connection type chip package. It belongs to the technical field of discrete semiconductor devices and integrated circuits. Background technique: [0002] Traditional chip packaging generally uses an indirect lead structure. The packaging structure is shown in Figures 1-2: the functional chip 1' is placed on the carrier base island of the metal lead frame 3', and the conductive or non-conductive glue 2' is used between the back of the chip 1' and the carrier base island of the metal lead frame 3' Connect, the front of the chip 1' and the lead pin of the metal lead frame 3' are welded with a signal guiding gold wire 4', and then the chip 1', the carrier base island of the metal lead frame 3' and the Signal leads gold wire 4' package. It mainly has the following deficiencies: [0003] 1. Gold wire welding is used between the chip and the metal lead frame, ther...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495
CPCH01L2224/32245
Inventor 梁志忠刘道明周正伟茅礼卿闻荣福
Owner JCET GROUP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com