Circuit device and manufacturing method of circuit device

Abstract

After a trench 54 is formed in a conductive foil 60, the circuit elements are mounted, and the insulating resin is applied on the conductive foil 60 as the support substrate. After being inverted, the conductive foil 60 is polished on the insulating resin 50 as the support substrate for separation into the conductive paths. Accordingly, it is possible to fabricate the circuit device in which the conductive paths 51 and the circuit elements 52 are supported by the insulating resin 50, without the use of the support substrate. And the interconnects L1 to L3 requisite for the circuit are formed, and can be prevented from slipping because of the curved structure 59 and a visor 58.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a circuit device and a method for manufacturing the circuit device, and more particularly to a thin-type circuit device and a method of manufacturing the thin-type circuit device without the need of providing a support substrate. [0003] 2. Description of the Related Art [0004] Conventionally, it has been demanded that a circuit device which is set in an electronic apparatus is reduced in size, thickness and weight, because the circuit device is used for a portable telephone, a portable computer and so on. [0005] For example, a semiconductor device as a circuit device is typically a package type semiconductor device which is conventionally sealed by normal transfer molding. This semiconductor device 1 is mounted on a printed circuit board PS as shown in FIG. 24. [0006] This package type semiconductor device 1 has a semiconductor chip 2 covered with a resin layer 3, with a lead termina...

AI Technical Summary

Benefits of technology

[0029] The present invention intends to obtain a semiconductor device which is easy to be manufactured, and has a high accuracy and reliability.

Problems solved by technology

However, this package type semiconductor device 1 had the lead terminal 4 out of the resin layer 3, and was too large in total size to meet smaller, thinner and lighter requirements.

Thereafter, the same manufacturing method of FIG. 26, up to coating the resin layer is followed, but since the ceramic substrate is very fragile, and is likely to break off, unlike a flexible sheet or the glass epoxy substrate, there is a problem with the difficulty of molding using die.

However, only these components were difficult to provide an electrical circuit device reduced in size, thickness and weight.

However, since the manufacturing method involves pasting the electrode on the substrate, the support substrate is required, and this glass epoxy substrate 5 could not be dispensed with.

Further, since the glass epoxy substrate 5 was thick, the circuit device was thick, limiting the possibility to reduce the size, thickness and weight of the device.

Hence, there was a problem with the long manufacturing process.

Accordingly, this slender wire has smaller contact area with the substrate, leading to exfoliation or curvature of the wire.

Particularly, the bonding pad for small signal has a small bonding area, which caused a film exfoliation.

There was a problem that the external lead pad 30 might be exfoliated due to an external force applied to the external lead.

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