Thermally-conductive electrically-insulating polymer-base material

Inactive Publication Date: 2005-06-23
DELPHI TECH INC
View PDF5 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0005] The present invention provides an electrically-insulating polymer-based material with improved thermal conductivity so as to be suitable for use as an adhesive for mounting and conducting heat from electronic devices. The material is also suitable for use as a potting compound and an encapsulation material for various electronic applications. The polymer-based material comprises a polymer matrix material in which are dispersed metal particles that are individually encapsulated by

Problems solved by technology

Heat generated by electronic devices during normal operation can cause overheating and device failure if not adequately conducted away.
With an ever-increasin

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Thermally-conductive electrically-insulating polymer-base material
  • Thermally-conductive electrically-insulating polymer-base material

Examples

Experimental program
Comparison scheme
Effect test

Example

[0010]FIGS. 1 through 3 represent three polymer-based materials formulated to have properties desired for a thermally-conductive adhesive in accordance with the present invention. The polymer-based material of each embodiment may also be used as a potting compound or an encapsulation material to pot or encapsulate a heat-generating power device on a circuit board or an entire electronic module, as shown in FIG. 4. In each embodiment, metal particles that are individually coated with a dielectric material are employed to promote the thermal conductivity of the polymer-based material while also providing suitable and stable electrical insulating properties.

[0011] With reference to FIG. 1, the polymer-based material 10 is represented as comprising a matrix material 12 in which coated metal particles 14 are dispersed to promote the thermal properties of the material 10. Because metals are electrically conductive, the particles 14 are provided with a dielectric coating 16 to ensure that...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Temperatureaaaaaaaaaa
Percent by massaaaaaaaaaa
Percent by massaaaaaaaaaa
Login to view more

Abstract

An electrically-insulating polymer-based material with improved thermal conductivity so as to be suitable for use as an adhesive for mounting and conducting heat from electronic devices. The polymer-based material comprises metal particles dispersed in a matrix material. The metal particles are encapsulated by a dielectric coating so that they are electrically insulated from each other. The polymer-based material may also comprise dielectric particles dispersed in the matrix material and/or the dielectric coating for the purpose of further increasing the thermal conductivity of the polymer-based material. The material is also suitable for use as a potting compound or an encapsulation material for various electronic applications.

Description

STATEMENT REGARDING FEDERALLY-SPONSORED RESEARCH [0001] Not applicable. BACKGROUND OF THE INVENTION [0002] The present invention generally relates to electrically insulating polymeric compositions that are suitable for use as adhesives, potting compounds and encapsulating materials for electronic devices. More particularly, this invention relates to an electrically-insulating polymer-base material with enhanced thermal conductivity so as to be particularly suitable for heat management of electronic devices. [0003] Heat generated by electronic devices during normal operation can cause overheating and device failure if not adequately conducted away. Steady-state heat can be removed from the device and dissipated to the surrounding environment by the manner in which the device is mounted to its supporting structure and the use of heat sinks that conduct and / or dissipate the heat. For example, it is standard practice to attach an integrated circuit (IC) chip and other power-dissipating ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C08K3/08
CPCC08K3/08C08K9/10C08L79/08
Inventor CHAUDHURI, ARUN K.MYERS, BRUCE A.
Owner DELPHI TECH INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap