Method for manufacturing substrate, release sheet, substrate manufacturing apparatus and method for manufacturing substrate using same

Inactive Publication Date: 2005-07-07
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0054] Another manufacturing apparatus of the present invention has plural pressuring holes at given places of the stage. The plural holes, provided where the mold releasing sheet passes, can separate the pressure to be applied to the lower prepreg and to the upper prepreg.
[0055] Still another manufacturing apparatus of the present invention can change the tension of the mold releasing sheet rolled on a supply reel disposed at a first end of the stage and on a take-up reel disposed at a second end of the stage. This structure allows peeling off the mold-releasing sheet advantageously with ease after the lamination.
[0056] Yet another manufacturing apparatus of the present invention can adjust the tension applied to the mold releasing sheet supplied from the supply reel and taken up by the take-up reel. This structure allows adjusting a loose amount of the sheet so that tension is not yet applied to the sheet after the supplying and discharging means (the mol

Problems solved by technology

The resin still remained there has been hardened almost completely, so that uniform thickness in resin cannot be expected even if some resin flows in from the vicinity in an onward step using a hot-press.
If undesirable porous sections occur on prepreg 51, etching solution enters int

Method used

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  • Method for manufacturing substrate, release sheet, substrate manufacturing apparatus and method for manufacturing substrate using same
  • Method for manufacturing substrate, release sheet, substrate manufacturing apparatus and method for manufacturing substrate using same
  • Method for manufacturing substrate, release sheet, substrate manufacturing apparatus and method for manufacturing substrate using same

Examples

Experimental program
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Example

Exemplary Embodiment 1

[0079]FIG. 1A-FIG. 1G show sectional views illustrating steps of manufacturing double-sided boards (two layers) which are to be inside core boards of multi-layer boards in accordance with the first exemplary embodiment of the present invention.

[0080]FIG. 1A shows aramid-epoxy sheet (hereinafter referred to as prepreg) 1 formed of composite in which aromatic polyamide non-woven fiber, of which dimensions are 400 mm square and 150 μm thick, is impregnated with thermosetting epoxy resin, and via 2 filled with conductive paste by printing. Via 2 is a through hole processed by laser beam.

[0081]FIG. 1B shows copper foil 3a situated on positioning stage 6, heater-punches 4a, 4b having a tip of approx. 10 mm across and working as a heating means, and mold-releasing sheet 5. The releasing properties of sheet 5 are increased by applying silicon to polypheneylene-sulfide of 75 μm thick. When sheet 5 is solidly pressed onto prepreg 1, the side undergone the release-proc...

Example

[0099] In this first embodiment, the steps of placing copper foils 3a, 3b on stage 6, then laminating prepreg, core board, prepreg, and copper foil sequentially in this order are described. However, the respective steps can be applied to another method, e.g. prepregs are placed on both sides of a core board, and the foregoing elements are bonded to both sides sequentially. There is still another laminating method: plural core boards and prepregs are piled up alternately so that the prepregs become the outer most layers.

[0100] In other words, the manufacturing method of the present invention produces a similar advantage in the following procedure: a mold-releasing sheet is disposed between the prepreg and the heater-punches, then the sheet is peeled off, and copper foils are put on the prepreg. Then the unit as a whole is heated by a hot-press to produce a multi-layer board.

[0101] In this embodiment, aramid-nonwoven fiber is used as a core material; however, woven fiber made from g...

Example

Exemplary Embodiment 2

[0108]FIG. 3 shows a perspective view of a manufacturing apparatus for manufacturing the boards of the present invention. FIG. 3 shows heater-punches 4a, 4b to be used as heating means, and positioning stage 6 having pressuring holes 24 at given places for pressing an underside of a board. Supply reels 22 are disposed at given places on one side of stage 6 for supplying mold-releasing sheet 5, and tape-like mold-releasing sheet 5 is wound on a plastic core, and this core is mounted to respective reels 22.

[0109] Sheet 5 supplied from reel 22 is guided by guide-roll 25a and fed onto stage 6, and travels through heater-punches 4a and 4b, which are disposed at given places on stage 6, such that sheet 5 divides the heater punches into upper section 4a and lower section 4b. Then sheet is guided by guide roll 25b and taken up by take-up reel 23.

[0110] Placement of sheet 5 as shown in FIG. 3, namely, placement of four pairs of heater-punches 4a and 4b, allows bondin...

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Abstract

A highly reliable and productive manufacturing method of boards and a manufacturing apparatus are provided. The manufacturing apparatus includes heater-punches (4a) and (4b) disposed above and under pressuring holes (24) provided on positioning stage (6) which positions and laminates board materials. The apparatus also includes a supplying and discharging means of a mold-releasing sheet, and the means is formed of supply reel (22), take-up reel (23), and guide rolls (25a) and (25b). The sheet is supplied and discharged passing between heater-punches (4a) placed above pressuring holes (24) and heater-punches (4b) placed under pressuring holes (24).

Description

TECHNICAL FIELD [0001] The present invention relates to a method of manufacturing double-sided boards or multi-layer boards in which circuit-patterns in plural layers are coupled to each other, a mold-releasing sheet, a manufacturing apparatus of boards, and a method of manufacturing boards using the same mold-releasing sheet and the same manufacturing apparatus. BACKGROUND ART [0002] In recent years, electronic devices have been downsized and packed with components at a higher density. This trend accompanies a strong request to use multi-layer boards not only in the industrial electronic field but also in the consumer electronic field. A denser populated multi-layer board, among others, depends on a multi-layering accuracy of multi-layered circuit patterns about its performance because the circuit-patterns become formed of finer pitches. Thus a higher multi-layering accuracy as well as a more productive multi-layering method is demanded. [0003] A conventional method of manufacturin...

Claims

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Application Information

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IPC IPC(8): B29C70/46C08J5/24H05K3/02H05K3/40H05K3/46
CPCB29C70/46Y10T156/1712B32B37/26B32B2037/268B32B2305/08B32B2311/12B32B2457/08C08J5/24H05K3/022H05K3/4069H05K3/4611H05K3/4614H05K3/4638H05K3/4652H05K3/4679H05K2201/0355H05K2203/0195H05K2203/0264H05K2203/065H05K2203/068B29L2031/3425Y10T156/16Y10T29/49126Y10T428/31Y10T29/49128B32B2398/10C08J5/246
Inventor HISHIMOTO, KUNIOTAKENAKA, TOSHIAKIHIRAISHI, YUKIHIRO
Owner PANASONIC CORP
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