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Method for manufacturing substrate, release sheet, substrate manufacturing apparatus and method for manufacturing substrate using same

Inactive Publication Date: 2005-07-07
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0031] peeling off the mold releasing sheet. The foregoing manufacturing method allows placing the prepreg over a metal foil or a board, or the prepreg over a preprag, and fixing the placed-over unit at given places, so that double sides boards or multi-layer boards are laminated each other accurately.
[0070] The manufacturing method using the manufacturing apparatus allows taking up the mold-releasing sheet only from one side after the prepreg is cooled down to its softening point, and at the same time, the sheet is sequentially and gradually peeled off the one side toward another side. As a result, the sheet can be peeled off smooth. The boards can be thus supplied steadily at a high productivity by the manufacturing method using the manufacturing apparatus which efficiently manufactures the boards.

Problems solved by technology

The resin still remained there has been hardened almost completely, so that uniform thickness in resin cannot be expected even if some resin flows in from the vicinity in an onward step using a hot-press.
If undesirable porous sections occur on prepreg 51, etching solution enters into those sections when circuit patterns are formed, and residue of the etching solution adversely influences the remaining manufacturing steps.
In other words, the conventional manufacturing method has a problem that the residue of etching solution causes pollution to the steps onward.

Method used

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  • Method for manufacturing substrate, release sheet, substrate manufacturing apparatus and method for manufacturing substrate using same
  • Method for manufacturing substrate, release sheet, substrate manufacturing apparatus and method for manufacturing substrate using same
  • Method for manufacturing substrate, release sheet, substrate manufacturing apparatus and method for manufacturing substrate using same

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exemplary embodiment 1

[0079]FIG. 1A-FIG. 1G show sectional views illustrating steps of manufacturing double-sided boards (two layers) which are to be inside core boards of multi-layer boards in accordance with the first exemplary embodiment of the present invention.

[0080]FIG. 1A shows aramid-epoxy sheet (hereinafter referred to as prepreg) 1 formed of composite in which aromatic polyamide non-woven fiber, of which dimensions are 400 mm square and 150 μm thick, is impregnated with thermosetting epoxy resin, and via 2 filled with conductive paste by printing. Via 2 is a through hole processed by laser beam.

[0081]FIG. 1B shows copper foil 3a situated on positioning stage 6, heater-punches 4a, 4b having a tip of approx. 10 mm across and working as a heating means, and mold-releasing sheet 5. The releasing properties of sheet 5 are increased by applying silicon to polypheneylene-sulfide of 75 μm thick. When sheet 5 is solidly pressed onto prepreg 1, the side undergone the release-process is brought into con...

exemplary embodiment 2

[0108]FIG. 3 shows a perspective view of a manufacturing apparatus for manufacturing the boards of the present invention. FIG. 3 shows heater-punches 4a, 4b to be used as heating means, and positioning stage 6 having pressuring holes 24 at given places for pressing an underside of a board. Supply reels 22 are disposed at given places on one side of stage 6 for supplying mold-releasing sheet 5, and tape-like mold-releasing sheet 5 is wound on a plastic core, and this core is mounted to respective reels 22.

[0109] Sheet 5 supplied from reel 22 is guided by guide-roll 25a and fed onto stage 6, and travels through heater-punches 4a and 4b, which are disposed at given places on stage 6, such that sheet 5 divides the heater punches into upper section 4a and lower section 4b. Then sheet is guided by guide roll 25b and taken up by take-up reel 23.

[0110] Placement of sheet 5 as shown in FIG. 3, namely, placement of four pairs of heater-punches 4a and 4b, allows bonding at four places at one...

exemplary embodiment 3

[0112] An operation of the manufacturing apparatus for the boards of the present invention is demonstrated with reference to FIGS. 4A-4E. In this demonstration, descriptions are particularly focused to the following two steps: solidly pressing prepreg 1 after prepreg 1 is laminated on copper foil 3a, and peeling-off mold-releasing sheet 5.

[0113]FIG. 4A shows prepreg 1 positioned and situated on copper 3a placed on positioning stage 6. Sheet 5 is disposed over prepreg 1, and supplied from supply reel 2. Sheet 5 is then guided by guide roll 25b and taken up by take-up reel 23. Both of supply reel 22 and take-up reel 23 have a tension adjusting function.

[0114]FIG. 4B shows the steps of heating and pressing by heater-punches 4a, 4b. Pressing heater-punches 4a, 4b prompts the following elements to lower almost at the same time: supply reel 22, guide rolls 25a, 25b, mold-releasing sheet 5, a supplying and discharging means (it is called a mold-releasing unit) of take-up reel 23. Tension...

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Abstract

A highly reliable and productive manufacturing method of boards and a manufacturing apparatus are provided. The manufacturing apparatus includes heater-punches (4a) and (4b) disposed above and under pressuring holes (24) provided on positioning stage (6) which positions and laminates board materials. The apparatus also includes a supplying and discharging means of a mold-releasing sheet, and the means is formed of supply reel (22), take-up reel (23), and guide rolls (25a) and (25b). The sheet is supplied and discharged passing between heater-punches (4a) placed above pressuring holes (24) and heater-punches (4b) placed under pressuring holes (24).

Description

TECHNICAL FIELD [0001] The present invention relates to a method of manufacturing double-sided boards or multi-layer boards in which circuit-patterns in plural layers are coupled to each other, a mold-releasing sheet, a manufacturing apparatus of boards, and a method of manufacturing boards using the same mold-releasing sheet and the same manufacturing apparatus. BACKGROUND ART [0002] In recent years, electronic devices have been downsized and packed with components at a higher density. This trend accompanies a strong request to use multi-layer boards not only in the industrial electronic field but also in the consumer electronic field. A denser populated multi-layer board, among others, depends on a multi-layering accuracy of multi-layered circuit patterns about its performance because the circuit-patterns become formed of finer pitches. Thus a higher multi-layering accuracy as well as a more productive multi-layering method is demanded. [0003] A conventional method of manufacturin...

Claims

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Application Information

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IPC IPC(8): B29C70/46C08J5/24H05K3/02H05K3/40H05K3/46
CPCB29C70/46Y10T156/1712B32B37/26B32B2037/268B32B2305/08B32B2311/12B32B2457/08C08J5/24H05K3/022H05K3/4069H05K3/4611H05K3/4614H05K3/4638H05K3/4652H05K3/4679H05K2201/0355H05K2203/0195H05K2203/0264H05K2203/065H05K2203/068B29L2031/3425Y10T156/16Y10T29/49126Y10T428/31Y10T29/49128B32B2398/10C08J5/246
Inventor HISHIMOTO, KUNIOTAKENAKA, TOSHIAKIHIRAISHI, YUKIHIRO
Owner PANASONIC CORP
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