Apparatus for the generation and supply of fluorine gas

a technology for fluorine gas and apparatus, applied in the direction of chemistry apparatus and processes, coatings, electrolysis components, etc., can solve the problems of high initial cost, high operating cost of the gas supply system, and high safety problems, and achieve the effect of safe and inexpensive structur

Inactive Publication Date: 2005-07-28
LAIR LIQUIDE SA POUR LETUDE & LEXPLOITATION DES PROCEDES GEORGES CLAUDE
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Benefits of technology

[0050] As has been described in detail hereinabove, this invention provides a fluorine gas-generation and -supply apparatus that is disposed in the gas ...

Problems solved by technology

The reasons for this relate not just to problems with the reliability of the gas composition, but also to the extreme danger associated with placing a cylinder filled to high pressures (typically at least 5 kg/cm2) with a strong oxidizer such as fluorine in the gas supply system of a semiconductor processing system.
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Method used

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  • Apparatus for the generation and supply of fluorine gas
  • Apparatus for the generation and supply of fluorine gas
  • Apparatus for the generation and supply of fluorine gas

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Embodiment Construction

[0029] Embodiments of this invention are explained in the following with reference to the drawings appended herewith. In the explanation that follows, those constituent elements that have approximately the same structure and function are assigned a common reference symbol and their explanation will be repeated only when necessary.

[0030]FIG. 1 contains a schematic drawing that illustrates a semiconductor processing system that incorporates an embodiment of the inventive apparatus for the generation and supply of fluorine gas. This semiconductor processing system contains a semiconductor processing apparatus 10 that executes a process, such as film formation, etching, or diffusion, on a target substrate such as a semiconductor wafer or LCD substrate.

[0031] The semiconductor processing apparatus 10 is provided with a process chamber 12 that holds the target substrate and in which the semiconductor process is implemented. Disposed within the process chamber 12 is a mounting platform 1...

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Abstract

To provide an apparatus for fluorine gas generation and supply that is disposed in the gas supply system of a semiconductor processing system and that in the event of abnormalities in the apparatus enables back up by a safe and inexpensive structure.
An apparatus 30 for the generation and supply of gas is disposed in the gas supply system of a semiconductor processing system. This apparatus 30 contains an electrolytic cell 34 that generates fluorine gas and a cylinder 62 that holds a substitute gas selected from the group consisting of nitrogen fluoride, sulfur fluoride, and chlorine fluoride. The electrolytic cell 34 and cylinder 62 are connected to a gas switching section 56 that selectively supplies a gas utilization section with fluorine gas from the electrolytic cell 34 or with substitute gas from the cylinder 62. A controller 40 controls the gas switching section 56 in such a manner that, upon detection of an abnormal state at the electrolytic cell 34 by an electrolytic cell detector 36, substitute gas is supplied from the cylinder 62 to the gas utilization section.

Description

FIELD OF THE INVENTION [0001] This invention relates to an apparatus that is disposed in the gas supply system of a semiconductor processing system and that generates and supplies fluorine gas. Semiconductor processing refers in this context to the various processes carried out in order to fabricate semiconductor devices and / or semiconductor device-connecting structures (e.g., interconnects, electrodes) on the substrate undergoing the processing (the target substrate) by the formation of semiconductor, dielectric, and conductive layers in specific patterns on the target substrate, such as a semiconductor wafer or LCD substrate. DESCRIPTION OF THE PRIOR ART [0002] A variety of semiconductor processes, such as film formation, etching, and diffusion, are carried out on the target substrate, e.g., a semiconductor wafer or LCD substrate, during the fabrication of semiconductor devices. The semiconductor processing systems used to carry out these treatments employ fluorine-type gases as p...

Claims

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Application Information

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IPC IPC(8): B01J4/00C23C16/44C25B1/24C25B15/00C25B15/02H01L21/02H01L21/302
CPCC23C16/4405C25B1/245C25B15/00C25B15/02
Inventor KENNEDY, COLINKIMURA, TAKAKOINO, MINORUSONOBE, JUN
Owner LAIR LIQUIDE SA POUR LETUDE & LEXPLOITATION DES PROCEDES GEORGES CLAUDE
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